APA (7 ম সংস্করণ) উদ্ধৃতি

M. H., M. Z., & S. R. A., I. (2023). A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering. Springer.

শিকাগো স্টাইল (17 তম সংস্করণ) উদ্ধৃতি

M. H., Mohd Zaki, এবং Idris S. R. A. A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering. Springer, 2023.

M.L.A (9 ম সংস্করণ) উদ্ধৃতি

M. H., Mohd Zaki, এবং Idris S. R. A. A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering. Springer, 2023.