Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting poi...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English English |
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Springer
2022
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf |
| _version_ | 1825815438151385088 |
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| author | Bashir, M. Nasir Saad, Hafiz Muhammad Muhammad, Rizwan Quazi, Moinuddin Mohammed Ali, Muhammad Mahmood Ahmed, Arslan E.M. Zaidi, Asad Ali Soudagar, Manzoore Elahi M. Haseeb, Abdul S.Md Abdul Naher, Sumsun |
| author_facet | Bashir, M. Nasir Saad, Hafiz Muhammad Muhammad, Rizwan Quazi, Moinuddin Mohammed Ali, Muhammad Mahmood Ahmed, Arslan E.M. Zaidi, Asad Ali Soudagar, Manzoore Elahi M. Haseeb, Abdul S.Md Abdul Naher, Sumsun |
| author_sort | Bashir, M. Nasir |
| collection | UMP |
| description | Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times. |
| first_indexed | 2024-03-06T13:13:28Z |
| format | Article |
| id | UMPir40187 |
| institution | Universiti Malaysia Pahang |
| language | English English |
| last_indexed | 2024-03-06T13:13:28Z |
| publishDate | 2022 |
| publisher | Springer |
| record_format | dspace |
| spelling | UMPir401872024-02-08T04:40:00Z http://umpir.ump.edu.my/id/eprint/40187/ Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint Bashir, M. Nasir Saad, Hafiz Muhammad Muhammad, Rizwan Quazi, Moinuddin Mohammed Ali, Muhammad Mahmood Ahmed, Arslan E.M. Zaidi, Asad Ali Soudagar, Manzoore Elahi M. Haseeb, Abdul S.Md Abdul Naher, Sumsun T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times. Springer 2022-10 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf pdf en http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf Bashir, M. Nasir and Saad, Hafiz Muhammad and Muhammad, Rizwan and Quazi, Moinuddin Mohammed and Ali, Muhammad Mahmood and Ahmed, Arslan E.M. and Zaidi, Asad Ali and Soudagar, Manzoore Elahi M. and Haseeb, Abdul S.Md Abdul and Naher, Sumsun (2022) Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint. Journal of Materials Science: Materials in Electronics, 33 (28). pp. 22499-22507. ISSN 0957-4522. (Published) https://doi.org/10.1007/s10854-022-09028-5 https://doi.org/10.1007/s10854-022-09028-5 |
| spellingShingle | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Bashir, M. Nasir Saad, Hafiz Muhammad Muhammad, Rizwan Quazi, Moinuddin Mohammed Ali, Muhammad Mahmood Ahmed, Arslan E.M. Zaidi, Asad Ali Soudagar, Manzoore Elahi M. Haseeb, Abdul S.Md Abdul Naher, Sumsun Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint |
| title | Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint |
| title_full | Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint |
| title_fullStr | Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint |
| title_full_unstemmed | Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint |
| title_short | Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint |
| title_sort | effects of tin particles addition on structural and mechanical properties of eutectic sn 58bi solder joint |
| topic | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics |
| url | http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf |
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