Microstructure Evolution at the Solder Joint During Isothermal Aging
The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...
| المؤلفون الرئيسيون: | , , , |
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| التنسيق: | Conference or Workshop Item |
| اللغة: | English |
| منشور في: |
IEEE
2014
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf |