Microstructure Evolution at the Solder Joint During Isothermal Aging
The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...
| Hlavní autoři: | , , , |
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| Médium: | Conference or Workshop Item |
| Jazyk: | English |
| Vydáno: |
IEEE
2014
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| Témata: | |
| On-line přístup: | http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf |