Microstructure Evolution at the Solder Joint During Isothermal Aging

Microstructure Evolution at the Solder Joint During Isothermal Aging

The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...

Полное описание

Библиографические подробности
Главные авторы:	Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Формат:	Conference or Workshop Item
Язык:	English
Опубликовано:	IEEE 2014
Предметы:	TJ Mechanical engineering and machinery
Online-ссылка:	http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf

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