OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS
Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure of dipping time and solder temperature. Durin...
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| Format: | Article |
| Language: | English |
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Politehnium Publishing House
2023-03-01
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| Series: | European Journal of Materials Science and Engineering |
| Subjects: | |
| Online Access: | https://ejmse.ro/articles/08_01_04_EJMSE-22-163.pdf |
| _version_ | 1797859124810088448 |
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| author | Mohd Izrul Izwan RAMLI Siti Farahnabilah MUHD AMLI Norainiza SAUD Dewi Suriyani CHE HALIN Nur Akrimi Maswa MD FAUZI |
| author_facet | Mohd Izrul Izwan RAMLI Siti Farahnabilah MUHD AMLI Norainiza SAUD Dewi Suriyani CHE HALIN Nur Akrimi Maswa MD FAUZI |
| author_sort | Mohd Izrul Izwan RAMLI |
| collection | DOAJ |
| description | Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure of dipping time and solder temperature. During soldering process, the temperature that used were 300°C and 400°C. The dipping time was split into three batches which is 20s, 60s, and 100s. The Sn-0.7Cu0.05Ni solder alloy was used in this analysis to shape the solder coating microstructure. In this analysis, an Optical Microscope (OM) was used to determine the microstructure of the shape of the solder coating microstructure. As dipping time and dipping speed increased, the interfacial IMC thickness was found to increase, grown up and getting thicker. This outcome results can be used as the basis in order to improve the solder joint properties. |
| first_indexed | 2024-04-09T21:24:25Z |
| format | Article |
| id | doaj.art-0017359e96f3466486e84705c8bfc407 |
| institution | Directory Open Access Journal |
| issn | 2537-4338 2537-4346 |
| language | English |
| last_indexed | 2024-04-09T21:24:25Z |
| publishDate | 2023-03-01 |
| publisher | Politehnium Publishing House |
| record_format | Article |
| series | European Journal of Materials Science and Engineering |
| spelling | doaj.art-0017359e96f3466486e84705c8bfc4072023-03-27T17:21:56ZengPolitehnium Publishing HouseEuropean Journal of Materials Science and Engineering2537-43382537-43462023-03-0181303510.36868/ejmse.2023.08.01.030OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONSMohd Izrul Izwan RAMLI0Siti Farahnabilah MUHD AMLI1Norainiza SAUD2Dewi Suriyani CHE HALIN3Nur Akrimi Maswa MD FAUZI4Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Geopolymer & Green Technology, Center of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Geopolymer & Green Technology, Center of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Perlis 02600, Malaysia Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure of dipping time and solder temperature. During soldering process, the temperature that used were 300°C and 400°C. The dipping time was split into three batches which is 20s, 60s, and 100s. The Sn-0.7Cu0.05Ni solder alloy was used in this analysis to shape the solder coating microstructure. In this analysis, an Optical Microscope (OM) was used to determine the microstructure of the shape of the solder coating microstructure. As dipping time and dipping speed increased, the interfacial IMC thickness was found to increase, grown up and getting thicker. This outcome results can be used as the basis in order to improve the solder joint properties.https://ejmse.ro/articles/08_01_04_EJMSE-22-163.pdfhot air soldering levelling (hasl)intermetallic compound (imc)sn-0.7cu0.05ni solder alloy |
| spellingShingle | Mohd Izrul Izwan RAMLI Siti Farahnabilah MUHD AMLI Norainiza SAUD Dewi Suriyani CHE HALIN Nur Akrimi Maswa MD FAUZI OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS European Journal of Materials Science and Engineering hot air soldering levelling (hasl) intermetallic compound (imc) sn-0.7cu0.05ni solder alloy |
| title | OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS |
| title_full | OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS |
| title_fullStr | OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS |
| title_full_unstemmed | OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS |
| title_short | OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS |
| title_sort | optimization of hot air solder leveling hasl machine for a robust surface finish in soldering applications |
| topic | hot air soldering levelling (hasl) intermetallic compound (imc) sn-0.7cu0.05ni solder alloy |
| url | https://ejmse.ro/articles/08_01_04_EJMSE-22-163.pdf |
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