Assembly technology of electronic components for e-textiles
This article deals with the issue of assembling conventional SMD components on textile substrates using UV-curable non-conductive adhesives. This technology is easily applicable in the textile industry. It thus enables the easy and fast production of e-textiles that are equipped with conventional el...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-04-01
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| Series: | Power Electronic Devices and Components |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370424000014 |
| _version_ | 1797256247834050560 |
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| author | Tomas Blecha Martin Hirman Jiri Navratil |
| author_facet | Tomas Blecha Martin Hirman Jiri Navratil |
| author_sort | Tomas Blecha |
| collection | DOAJ |
| description | This article deals with the issue of assembling conventional SMD components on textile substrates using UV-curable non-conductive adhesives. This technology is easily applicable in the textile industry. It thus enables the easy and fast production of e-textiles that are equipped with conventional electronic components or even entire electronic modules. The article describes the principle of this innovative technology. Furthermore, comprehensive results of testing the effect of mechanical stress, chemical cleaning, and climatic changes on e-textiles with assembled SMD components on the change in contact resistance are presented here. The results show that this technology can be used for assembling and encapsulating SMD components on a textile substrate in the realization of e-textiles. |
| first_indexed | 2024-04-24T22:18:43Z |
| format | Article |
| id | doaj.art-0067b952f2074d90b77498b54696f864 |
| institution | Directory Open Access Journal |
| issn | 2772-3704 |
| language | English |
| last_indexed | 2024-04-24T22:18:43Z |
| publishDate | 2024-04-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Power Electronic Devices and Components |
| spelling | doaj.art-0067b952f2074d90b77498b54696f8642024-03-20T06:11:37ZengElsevierPower Electronic Devices and Components2772-37042024-04-017100056Assembly technology of electronic components for e-textilesTomas Blecha0Martin Hirman1Jiri Navratil2Corresponding author.; Department of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia in Pilsen, Univerzitni 8, Pilsen 301 00, Czech RepublicDepartment of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia in Pilsen, Univerzitni 8, Pilsen 301 00, Czech RepublicDepartment of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia in Pilsen, Univerzitni 8, Pilsen 301 00, Czech RepublicThis article deals with the issue of assembling conventional SMD components on textile substrates using UV-curable non-conductive adhesives. This technology is easily applicable in the textile industry. It thus enables the easy and fast production of e-textiles that are equipped with conventional electronic components or even entire electronic modules. The article describes the principle of this innovative technology. Furthermore, comprehensive results of testing the effect of mechanical stress, chemical cleaning, and climatic changes on e-textiles with assembled SMD components on the change in contact resistance are presented here. The results show that this technology can be used for assembling and encapsulating SMD components on a textile substrate in the realization of e-textiles.http://www.sciencedirect.com/science/article/pii/S2772370424000014E-textileNon-conductive adhesiveUV-curable adhesiveSMD assembly technologyContact resistance |
| spellingShingle | Tomas Blecha Martin Hirman Jiri Navratil Assembly technology of electronic components for e-textiles Power Electronic Devices and Components E-textile Non-conductive adhesive UV-curable adhesive SMD assembly technology Contact resistance |
| title | Assembly technology of electronic components for e-textiles |
| title_full | Assembly technology of electronic components for e-textiles |
| title_fullStr | Assembly technology of electronic components for e-textiles |
| title_full_unstemmed | Assembly technology of electronic components for e-textiles |
| title_short | Assembly technology of electronic components for e-textiles |
| title_sort | assembly technology of electronic components for e textiles |
| topic | E-textile Non-conductive adhesive UV-curable adhesive SMD assembly technology Contact resistance |
| url | http://www.sciencedirect.com/science/article/pii/S2772370424000014 |
| work_keys_str_mv | AT tomasblecha assemblytechnologyofelectroniccomponentsforetextiles AT martinhirman assemblytechnologyofelectroniccomponentsforetextiles AT jirinavratil assemblytechnologyofelectroniccomponentsforetextiles |