Capillary filling ability of Sn-Zn solder on SiC ceramic surface under electromagnetic ultrasonic action
In this work, we present the capillary filling behavior of Sn-9Zn molten solder on the surface of SiC ceramic with different initial contact angles with and without electromagnetic ultrasonic action. The results showed that the capillary filling behavior did not easily occur in the native state. Ele...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423002120 |