Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge
Abstract Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge s...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2024-04-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-024-47147-1 |
| _version_ | 1797219706704232448 |
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| author | Ke Zhan Yucong Chen Zhiyuan Xiong Yulun Zhang Siyuan Ding Fangzheng Zhen Zhenshi Liu Qiang Wei Minsu Liu Bo Sun Hui-Ming Cheng Ling Qiu |
| author_facet | Ke Zhan Yucong Chen Zhiyuan Xiong Yulun Zhang Siyuan Ding Fangzheng Zhen Zhenshi Liu Qiang Wei Minsu Liu Bo Sun Hui-Ming Cheng Ling Qiu |
| author_sort | Ke Zhan |
| collection | DOAJ |
| description | Abstract Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in2 KW−1, demonstrating effective cooling of fast-charging batteries at a thickness 2-5 times thinner than commercial products. |
| first_indexed | 2024-04-24T12:37:55Z |
| format | Article |
| id | doaj.art-01ad58956b8044cd9cf612513d26ff5c |
| institution | Directory Open Access Journal |
| issn | 2041-1723 |
| language | English |
| last_indexed | 2024-04-24T12:37:55Z |
| publishDate | 2024-04-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Nature Communications |
| spelling | doaj.art-01ad58956b8044cd9cf612513d26ff5c2024-04-07T11:23:15ZengNature PortfolioNature Communications2041-17232024-04-0115111210.1038/s41467-024-47147-1Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridgeKe Zhan0Yucong Chen1Zhiyuan Xiong2Yulun Zhang3Siyuan Ding4Fangzheng Zhen5Zhenshi Liu6Qiang Wei7Minsu Liu8Bo Sun9Hui-Ming Cheng10Ling Qiu11Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversityShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversitySchool of Light Industry and Engineering, South China University of TechnologyShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversityShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversityMonash Suzhou Research Institute (MSRI), Monash UniversitySunwoda Electronic Co., Ltd.Vivo Mobile Communication Co., Ltd.Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversityShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversityShenzhen Key Lab of Energy Materials for Carbon Neutrality, Shenzhen Institute of Advanced Technology, Chinese Academy of SciencesShenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua UniversityAbstract Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in2 KW−1, demonstrating effective cooling of fast-charging batteries at a thickness 2-5 times thinner than commercial products.https://doi.org/10.1038/s41467-024-47147-1 |
| spellingShingle | Ke Zhan Yucong Chen Zhiyuan Xiong Yulun Zhang Siyuan Ding Fangzheng Zhen Zhenshi Liu Qiang Wei Minsu Liu Bo Sun Hui-Ming Cheng Ling Qiu Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge Nature Communications |
| title | Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge |
| title_full | Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge |
| title_fullStr | Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge |
| title_full_unstemmed | Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge |
| title_short | Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge |
| title_sort | low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc like phonon bridge |
| url | https://doi.org/10.1038/s41467-024-47147-1 |
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