Printed circuit board embedded power semiconductors: A technology review
Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection r...
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| Format: | Article |
| Language: | English |
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Elsevier
2022-10-01
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| Series: | Power Electronic Devices and Components |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370422000141 |
| _version_ | 1797989407876186112 |
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| author | Till Huesgen |
| author_facet | Till Huesgen |
| author_sort | Till Huesgen |
| collection | DOAJ |
| description | Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection resistances and parasitic inductances. Both contribute to a higher system-level efficiency, as conduction and switching losses are reduced. Moreover, the use of thick Cu substrates allows efficient heat removal, due to a low thermal resistance. Therefore, PCB embedding has received a lot of attention in the power electronics community for more than a decade. This article aims to provide a comprehensive review of the scientific literature on the topic ranging from basic fabrication technology over module or system-level demonstrators for electrical and thermal testing to reliability studies. Performance indicators, such as the commutation loop inductance Lσ, the chip area independent thermal resistance Rth × Achip, allow a comparison of different approaches and benchmarking with conventional power modules. Several publications report stray inductances below 1 nH and chip area independent thermal resistances in the range of 20…30 mm²K/W. |
| first_indexed | 2024-04-11T08:19:48Z |
| format | Article |
| id | doaj.art-01b2c8199cbe4f72adbc34a4425a3701 |
| institution | Directory Open Access Journal |
| issn | 2772-3704 |
| language | English |
| last_indexed | 2024-04-11T08:19:48Z |
| publishDate | 2022-10-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Power Electronic Devices and Components |
| spelling | doaj.art-01b2c8199cbe4f72adbc34a4425a37012022-12-22T04:34:59ZengElsevierPower Electronic Devices and Components2772-37042022-10-013100017Printed circuit board embedded power semiconductors: A technology reviewTill Huesgen0Electronics Integration Laboratory, University of Applied Sciences Kempten, Bahnhofstr. 61, 87435 Kempten, GermanyEmbedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection resistances and parasitic inductances. Both contribute to a higher system-level efficiency, as conduction and switching losses are reduced. Moreover, the use of thick Cu substrates allows efficient heat removal, due to a low thermal resistance. Therefore, PCB embedding has received a lot of attention in the power electronics community for more than a decade. This article aims to provide a comprehensive review of the scientific literature on the topic ranging from basic fabrication technology over module or system-level demonstrators for electrical and thermal testing to reliability studies. Performance indicators, such as the commutation loop inductance Lσ, the chip area independent thermal resistance Rth × Achip, allow a comparison of different approaches and benchmarking with conventional power modules. Several publications report stray inductances below 1 nH and chip area independent thermal resistances in the range of 20…30 mm²K/W.http://www.sciencedirect.com/science/article/pii/S2772370422000141PCB embeddingPower semiconductorsPower electronicsAssembly and interconnection technology |
| spellingShingle | Till Huesgen Printed circuit board embedded power semiconductors: A technology review Power Electronic Devices and Components PCB embedding Power semiconductors Power electronics Assembly and interconnection technology |
| title | Printed circuit board embedded power semiconductors: A technology review |
| title_full | Printed circuit board embedded power semiconductors: A technology review |
| title_fullStr | Printed circuit board embedded power semiconductors: A technology review |
| title_full_unstemmed | Printed circuit board embedded power semiconductors: A technology review |
| title_short | Printed circuit board embedded power semiconductors: A technology review |
| title_sort | printed circuit board embedded power semiconductors a technology review |
| topic | PCB embedding Power semiconductors Power electronics Assembly and interconnection technology |
| url | http://www.sciencedirect.com/science/article/pii/S2772370422000141 |
| work_keys_str_mv | AT tillhuesgen printedcircuitboardembeddedpowersemiconductorsatechnologyreview |