Ultra-Stretchable Interconnects for High-Density Stretchable Electronics
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for pr...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2017-09-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/8/9/277 |
| _version_ | 1811204765066985472 |
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| author | Salman Shafqat Johan P. M. Hoefnagels Angel Savov Shivani Joshi Ronald Dekker Marc G. D. Geers |
| author_facet | Salman Shafqat Johan P. M. Hoefnagels Angel Savov Shivani Joshi Ronald Dekker Marc G. D. Geers |
| author_sort | Salman Shafqat |
| collection | DOAJ |
| description | The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices. |
| first_indexed | 2024-04-12T03:19:16Z |
| format | Article |
| id | doaj.art-0298817507e04bfab8c3e4ac274f7e81 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-04-12T03:19:16Z |
| publishDate | 2017-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-0298817507e04bfab8c3e4ac274f7e812022-12-22T03:49:58ZengMDPI AGMicromachines2072-666X2017-09-018927710.3390/mi8090277mi8090277Ultra-Stretchable Interconnects for High-Density Stretchable ElectronicsSalman Shafqat0Johan P. M. Hoefnagels1Angel Savov2Shivani Joshi3Ronald Dekker4Marc G. D. Geers5Department of Mechanical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The NetherlandsDepartment of Mechanical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The NetherlandsDepartment of Microelectronics, Delft University of Technology, 2628 CD Delft, The NetherlandsDepartment of Microelectronics, Delft University of Technology, 2628 CD Delft, The NetherlandsDepartment of Microelectronics, Delft University of Technology, 2628 CD Delft, The NetherlandsDepartment of Mechanical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The NetherlandsThe exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.https://www.mdpi.com/2072-666X/8/9/277stretchable electronicsultra-stretchabilitycomplementary metal-oxide semiconductor (CMOS) processingminiaturized interconnectsmechanical size-effects |
| spellingShingle | Salman Shafqat Johan P. M. Hoefnagels Angel Savov Shivani Joshi Ronald Dekker Marc G. D. Geers Ultra-Stretchable Interconnects for High-Density Stretchable Electronics Micromachines stretchable electronics ultra-stretchability complementary metal-oxide semiconductor (CMOS) processing miniaturized interconnects mechanical size-effects |
| title | Ultra-Stretchable Interconnects for High-Density Stretchable Electronics |
| title_full | Ultra-Stretchable Interconnects for High-Density Stretchable Electronics |
| title_fullStr | Ultra-Stretchable Interconnects for High-Density Stretchable Electronics |
| title_full_unstemmed | Ultra-Stretchable Interconnects for High-Density Stretchable Electronics |
| title_short | Ultra-Stretchable Interconnects for High-Density Stretchable Electronics |
| title_sort | ultra stretchable interconnects for high density stretchable electronics |
| topic | stretchable electronics ultra-stretchability complementary metal-oxide semiconductor (CMOS) processing miniaturized interconnects mechanical size-effects |
| url | https://www.mdpi.com/2072-666X/8/9/277 |
| work_keys_str_mv | AT salmanshafqat ultrastretchableinterconnectsforhighdensitystretchableelectronics AT johanpmhoefnagels ultrastretchableinterconnectsforhighdensitystretchableelectronics AT angelsavov ultrastretchableinterconnectsforhighdensitystretchableelectronics AT shivanijoshi ultrastretchableinterconnectsforhighdensitystretchableelectronics AT ronalddekker ultrastretchableinterconnectsforhighdensitystretchableelectronics AT marcgdgeers ultrastretchableinterconnectsforhighdensitystretchableelectronics |