Composition-Tunable Properties of Cu(Ag) Alloy for Hybrid Bonding Applications

In the present study, the properties of Cu(Ag) alloy films were studied to evaluate their potential use as an alternate material for interconnection in hybrid bonding. Thin alloy films of Cu(Ag) were deposited by pulsed electrochemical deposition (PED) using a sulfuric acid-based bath, rotating disk...

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Bibliographic Details
Main Authors: Sarabjot Singh, Kathleen Dunn
Format: Article
Language:English
Published: MDPI AG 2023-12-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/16/23/7481

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