Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler
Porous Copper (Cu) was brazed to Cu plates using Cu-9.7Sn-5.7Ni-7P amorphous filler metal. The effects of brazing parameters on the porous Cu and brazed joints were investigated. The furnace brazing temperatures employed were 660 °C and 680 °C, and the holding times were 10 and 15...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-03-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/10/3/416 |
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| author | Mian Muhammad Sami Tuan Zaharinie Farazila Yusof Tadashi Ariga |
| author_facet | Mian Muhammad Sami Tuan Zaharinie Farazila Yusof Tadashi Ariga |
| author_sort | Mian Muhammad Sami |
| collection | DOAJ |
| description | Porous Copper (Cu) was brazed to Cu plates using Cu-9.7Sn-5.7Ni-7P amorphous filler metal. The effects of brazing parameters on the porous Cu and brazed joints were investigated. The furnace brazing temperatures employed were 660 °C and 680 °C, and the holding times were 10 and 15 min. After brazing, the microstructure was analyzed using Scanning Electron Microscope (SEM) equipped with Electron Dispersive X-ray Spectroscope (EDS). SEM results showed that the thickness of the brazed seam at the base joint decreased with increasing temperature and time. At low brazing temperature, microvoids and cracks were observed at the joint interface. The microvoids and cracks disappeared in the sample brazed at 680 °C for 15 min, and higher diffusion of the filler was noted in the overall bonded region. The formation of Cu-P, Cu-Ni, and Ni-Sn phases at the joint interface was validated using X-ray diffraction. The phases formed increased the hardness of the brazed joints and porous Copper. It was observed that the rigidity of porous Copper tends to increase due to surface hardening effects. The rigidity of porous Cu after brazing is important in ensuring minimal deformation during cooling device servicing, which is an integral feature of prospect product development. |
| first_indexed | 2024-12-21T17:56:51Z |
| format | Article |
| id | doaj.art-03f2d00de54446928f9c84d20be3abc5 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-12-21T17:56:51Z |
| publishDate | 2020-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-03f2d00de54446928f9c84d20be3abc52022-12-21T18:55:10ZengMDPI AGMetals2075-47012020-03-0110341610.3390/met10030416met10030416Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P FillerMian Muhammad Sami0Tuan Zaharinie1Farazila Yusof2Tadashi Ariga3Department of Mechanical Engineering, University of Malaya, Kuala Lumpur 50603, MalaysiaDepartment of Mechanical Engineering, University of Malaya, Kuala Lumpur 50603, MalaysiaDepartment of Mechanical Engineering, University of Malaya, Kuala Lumpur 50603, MalaysiaDepartment of Materials Science, School of Engineering, Tokai University, Kanagawa 259-1292, JapanPorous Copper (Cu) was brazed to Cu plates using Cu-9.7Sn-5.7Ni-7P amorphous filler metal. The effects of brazing parameters on the porous Cu and brazed joints were investigated. The furnace brazing temperatures employed were 660 °C and 680 °C, and the holding times were 10 and 15 min. After brazing, the microstructure was analyzed using Scanning Electron Microscope (SEM) equipped with Electron Dispersive X-ray Spectroscope (EDS). SEM results showed that the thickness of the brazed seam at the base joint decreased with increasing temperature and time. At low brazing temperature, microvoids and cracks were observed at the joint interface. The microvoids and cracks disappeared in the sample brazed at 680 °C for 15 min, and higher diffusion of the filler was noted in the overall bonded region. The formation of Cu-P, Cu-Ni, and Ni-Sn phases at the joint interface was validated using X-ray diffraction. The phases formed increased the hardness of the brazed joints and porous Copper. It was observed that the rigidity of porous Copper tends to increase due to surface hardening effects. The rigidity of porous Cu after brazing is important in ensuring minimal deformation during cooling device servicing, which is an integral feature of prospect product development.https://www.mdpi.com/2075-4701/10/3/416brazingporous coppercopper foammicrostructureamorphous |
| spellingShingle | Mian Muhammad Sami Tuan Zaharinie Farazila Yusof Tadashi Ariga Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler Metals brazing porous copper copper foam microstructure amorphous |
| title | Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler |
| title_full | Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler |
| title_fullStr | Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler |
| title_full_unstemmed | Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler |
| title_short | Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler |
| title_sort | investigation on strength and microstructural evolution of porous cu cu brazed joints using cu ni sn p filler |
| topic | brazing porous copper copper foam microstructure amorphous |
| url | https://www.mdpi.com/2075-4701/10/3/416 |
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