Research progress on terahertz integrated power amplifier

In this paper, the current development status and bottleneck problems of terahertz science and technology are presented. The emphasis of discussion is on research progress of the core component in terahertz circuits, monolithic integrated power amplifier. According to the kinds of base material in i...

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Main Authors: Han Jiangan, Cheng Xu
Format: Article
Language:zho
Published: National Computer System Engineering Research Institute of China 2019-07-01
Series:Dianzi Jishu Yingyong
Subjects:
Online Access:http://www.chinaaet.com/article/3000105763
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author Han Jiangan
Cheng Xu
author_facet Han Jiangan
Cheng Xu
author_sort Han Jiangan
collection DOAJ
description In this paper, the current development status and bottleneck problems of terahertz science and technology are presented. The emphasis of discussion is on research progress of the core component in terahertz circuits, monolithic integrated power amplifier. According to the kinds of base material in integrated circuit(IC) design, compound including InP and GaAs terahertz amplifier IC are compared with those made by silicon including bulk CMOS and SiGe. Basing on this category standard by material, the performances of terahertz amplifier IC are analyzed and concluded in the aspects of circuit topology and specifications.
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spelling doaj.art-04a1c99c327041798c9db4f5d5a37ddf2022-12-21T18:57:24ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982019-07-01457192210.16157/j.issn.0258-7998.1997043000105763Research progress on terahertz integrated power amplifierHan Jiangan0Cheng Xu1Microsystem & Terahertz Research Center,China Academy of Engineering Physics,Chengdu 610299,ChinaMicrosystem & Terahertz Research Center,China Academy of Engineering Physics,Chengdu 610299,ChinaIn this paper, the current development status and bottleneck problems of terahertz science and technology are presented. The emphasis of discussion is on research progress of the core component in terahertz circuits, monolithic integrated power amplifier. According to the kinds of base material in integrated circuit(IC) design, compound including InP and GaAs terahertz amplifier IC are compared with those made by silicon including bulk CMOS and SiGe. Basing on this category standard by material, the performances of terahertz amplifier IC are analyzed and concluded in the aspects of circuit topology and specifications.http://www.chinaaet.com/article/3000105763terahertzintegrated circuitpower amplifiermmic
spellingShingle Han Jiangan
Cheng Xu
Research progress on terahertz integrated power amplifier
Dianzi Jishu Yingyong
terahertz
integrated circuit
power amplifier
mmic
title Research progress on terahertz integrated power amplifier
title_full Research progress on terahertz integrated power amplifier
title_fullStr Research progress on terahertz integrated power amplifier
title_full_unstemmed Research progress on terahertz integrated power amplifier
title_short Research progress on terahertz integrated power amplifier
title_sort research progress on terahertz integrated power amplifier
topic terahertz
integrated circuit
power amplifier
mmic
url http://www.chinaaet.com/article/3000105763
work_keys_str_mv AT hanjiangan researchprogressonterahertzintegratedpoweramplifier
AT chengxu researchprogressonterahertzintegratedpoweramplifier