Materials and challenges of 3D printing of emerging memory devices
The continuous development of the semiconductor industry to meet the increasing demand of modern electronic devices which can enhance computing capabilities is attributed to the exploration of efficient, simple, high-speed operation and multistate information storage capacity of electronic devices c...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-10-01
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| Series: | Memories - Materials, Devices, Circuits and Systems |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773064623000440 |
| _version_ | 1797656093726343168 |
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| author | Iulia Salaoru Swapnodoot Ganguly Dave Morris Shashi Paul |
| author_facet | Iulia Salaoru Swapnodoot Ganguly Dave Morris Shashi Paul |
| author_sort | Iulia Salaoru |
| collection | DOAJ |
| description | The continuous development of the semiconductor industry to meet the increasing demand of modern electronic devices which can enhance computing capabilities is attributed to the exploration of efficient, simple, high-speed operation and multistate information storage capacity of electronic devices called memory devices. Nowadays, one of the main challenges the industry faces is limitations in manufacturing as the current fabrication pathway is complex and relies on the use of rigid substrates that do not match with the needs of industry for flexible, bendable electronics. 3D printing has a huge potential to address this challenge and to completely replace the current fabrication pathways and protocols. In this paper, the materials and the 3D printing technologies that have been explored to fabricate an emerging flexible, bendable memory device will be presented. |
| first_indexed | 2024-03-11T17:24:23Z |
| format | Article |
| id | doaj.art-0556f5649a194418897e6dae67f2e709 |
| institution | Directory Open Access Journal |
| issn | 2773-0646 |
| language | English |
| last_indexed | 2024-03-11T17:24:23Z |
| publishDate | 2023-10-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Memories - Materials, Devices, Circuits and Systems |
| spelling | doaj.art-0556f5649a194418897e6dae67f2e7092023-10-19T04:23:05ZengElsevierMemories - Materials, Devices, Circuits and Systems2773-06462023-10-015100067Materials and challenges of 3D printing of emerging memory devicesIulia Salaoru0Swapnodoot Ganguly1Dave Morris2Shashi Paul3Emerging Technologies Research Center, De Montfort University, The Gateway, Leicester LE18BH, United KingdomEmerging Technologies Research Center, De Montfort University, The Gateway, Leicester LE18BH, United KingdomEmerging Technologies Research Center, De Montfort University, The Gateway, Leicester LE18BH, United KingdomCorresponding author.; Emerging Technologies Research Center, De Montfort University, The Gateway, Leicester LE18BH, United KingdomThe continuous development of the semiconductor industry to meet the increasing demand of modern electronic devices which can enhance computing capabilities is attributed to the exploration of efficient, simple, high-speed operation and multistate information storage capacity of electronic devices called memory devices. Nowadays, one of the main challenges the industry faces is limitations in manufacturing as the current fabrication pathway is complex and relies on the use of rigid substrates that do not match with the needs of industry for flexible, bendable electronics. 3D printing has a huge potential to address this challenge and to completely replace the current fabrication pathways and protocols. In this paper, the materials and the 3D printing technologies that have been explored to fabricate an emerging flexible, bendable memory device will be presented.http://www.sciencedirect.com/science/article/pii/S2773064623000440Printable memoryBistabilityRe-RAMFully-printable memory |
| spellingShingle | Iulia Salaoru Swapnodoot Ganguly Dave Morris Shashi Paul Materials and challenges of 3D printing of emerging memory devices Memories - Materials, Devices, Circuits and Systems Printable memory Bistability Re-RAM Fully-printable memory |
| title | Materials and challenges of 3D printing of emerging memory devices |
| title_full | Materials and challenges of 3D printing of emerging memory devices |
| title_fullStr | Materials and challenges of 3D printing of emerging memory devices |
| title_full_unstemmed | Materials and challenges of 3D printing of emerging memory devices |
| title_short | Materials and challenges of 3D printing of emerging memory devices |
| title_sort | materials and challenges of 3d printing of emerging memory devices |
| topic | Printable memory Bistability Re-RAM Fully-printable memory |
| url | http://www.sciencedirect.com/science/article/pii/S2773064623000440 |
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