Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES)
This report presents influence of water and copper salt on the anodic dissolution of metallic copper in a eutectic solvent of choline chloride and ethylene glycol (DES) in a 1 : 2 molar ratio. The mechanism of copper dissolution anodically was investigated using anodic linear sweep voltammetry (LSV)...
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| Format: | Article |
| Language: | English |
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The Electrochemical Society of Japan
2021-01-01
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| Series: | Electrochemistry |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/electrochemistry/89/1/89_20-00129/_pdf/-char/en |
| _version_ | 1797970901384298496 |
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| author | Wrya O. KARIM Jamil A. JUMA Khalid M. OMER Kosar Hikmat HAMA AZIZ Yousif M. SALAH Shujahadeen B. AZIZ |
| author_facet | Wrya O. KARIM Jamil A. JUMA Khalid M. OMER Kosar Hikmat HAMA AZIZ Yousif M. SALAH Shujahadeen B. AZIZ |
| author_sort | Wrya O. KARIM |
| collection | DOAJ |
| description | This report presents influence of water and copper salt on the anodic dissolution of metallic copper in a eutectic solvent of choline chloride and ethylene glycol (DES) in a 1 : 2 molar ratio. The mechanism of copper dissolution anodically was investigated using anodic linear sweep voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Atomic force microscope (AFM) was used to examine the morphology and topography of the surface after electrochemical dissolution course. The addition of 1, 4, 8, 16 and 20 vol% of water cause pitting and has no significant impact on the electrochemical behavior, in particular the shape of anodic linear sweep voltammetry remains unchanged. The more profound effect was seen from the microscopic analysis. The addition of 0.1 and 0.81 M CuCl2 into this eutectic solvent resulted in relatively high resistance at the interfacial region where charge transfer occurs during anodic dissolution of metallic copper using impedance responses. The results confirmed that water will not affect anodic dissolution behavior and the chemistry of dissolution in the deep eutectic solvent. |
| first_indexed | 2024-04-11T03:24:18Z |
| format | Article |
| id | doaj.art-05e638c3cdeb49db91e16cf14a3513b6 |
| institution | Directory Open Access Journal |
| issn | 2186-2451 |
| language | English |
| last_indexed | 2024-04-11T03:24:18Z |
| publishDate | 2021-01-01 |
| publisher | The Electrochemical Society of Japan |
| record_format | Article |
| series | Electrochemistry |
| spelling | doaj.art-05e638c3cdeb49db91e16cf14a3513b62023-01-02T07:46:50ZengThe Electrochemical Society of JapanElectrochemistry2186-24512021-01-01891717410.5796/electrochemistry.20-00129electrochemistryEffect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES)Wrya O. KARIM0Jamil A. JUMA1Khalid M. OMER2Kosar Hikmat HAMA AZIZ3Yousif M. SALAH4Shujahadeen B. AZIZ5Chemistry Department, College of Science, University of SulaimaniDepartment of Chemistry, Faculty of Science and Health, Koya UniversityChemistry Department, College of Science, University of SulaimaniChemistry Department, College of Science, University of SulaimaniChemistry Department, College of Science, University of SulaimaniAdvanced Polymeric Materials Research Lab., Department of Physics, College of Science, University of SulaimaniThis report presents influence of water and copper salt on the anodic dissolution of metallic copper in a eutectic solvent of choline chloride and ethylene glycol (DES) in a 1 : 2 molar ratio. The mechanism of copper dissolution anodically was investigated using anodic linear sweep voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Atomic force microscope (AFM) was used to examine the morphology and topography of the surface after electrochemical dissolution course. The addition of 1, 4, 8, 16 and 20 vol% of water cause pitting and has no significant impact on the electrochemical behavior, in particular the shape of anodic linear sweep voltammetry remains unchanged. The more profound effect was seen from the microscopic analysis. The addition of 0.1 and 0.81 M CuCl2 into this eutectic solvent resulted in relatively high resistance at the interfacial region where charge transfer occurs during anodic dissolution of metallic copper using impedance responses. The results confirmed that water will not affect anodic dissolution behavior and the chemistry of dissolution in the deep eutectic solvent.https://www.jstage.jst.go.jp/article/electrochemistry/89/1/89_20-00129/_pdf/-char/enanodic dissolutionanodic linear sweep studydeep eutectic solventimpedance |
| spellingShingle | Wrya O. KARIM Jamil A. JUMA Khalid M. OMER Kosar Hikmat HAMA AZIZ Yousif M. SALAH Shujahadeen B. AZIZ Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES) Electrochemistry anodic dissolution anodic linear sweep study deep eutectic solvent impedance |
| title | Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES) |
| title_full | Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES) |
| title_fullStr | Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES) |
| title_full_unstemmed | Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES) |
| title_short | Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES) |
| title_sort | effect of copper ion and water on anodic dissolution of metallic copper in a deep eutectic solvent des |
| topic | anodic dissolution anodic linear sweep study deep eutectic solvent impedance |
| url | https://www.jstage.jst.go.jp/article/electrochemistry/89/1/89_20-00129/_pdf/-char/en |
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