Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper
The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstru...
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MDPI AG
2018-04-01
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| Series: | Metals |
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| Online Access: | http://www.mdpi.com/2075-4701/8/4/274 |
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| author | Roman Koleňák Igor Kostolný Jaromír Drápala Martin Sahul Ján Urminský |
| author_facet | Roman Koleňák Igor Kostolný Jaromír Drápala Martin Sahul Ján Urminský |
| author_sort | Roman Koleňák |
| collection | DOAJ |
| description | The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti3In4) and silver (AgIn2) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg)6In5 and (AgCu)In2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials. |
| first_indexed | 2024-12-11T08:40:11Z |
| format | Article |
| id | doaj.art-060a5baa4eed453ca72e8ec056f56c74 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-12-11T08:40:11Z |
| publishDate | 2018-04-01 |
| publisher | MDPI AG |
| record_format | Article |
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| spelling | doaj.art-060a5baa4eed453ca72e8ec056f56c742022-12-22T01:14:16ZengMDPI AGMetals2075-47012018-04-018427410.3390/met8040274met8040274Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and CopperRoman Koleňák0Igor Kostolný1Jaromír Drápala2Martin Sahul3Ján Urminský4Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jána Bottu č. 2781/25, 917 24 Trnava, SlovakiaFaculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jána Bottu č. 2781/25, 917 24 Trnava, SlovakiaFMMI—Faculty of Metallurgy and Material Engineering, 17. listopadu 15, Poruba, 708 33 Ostrava, Czech RepublicFaculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jána Bottu č. 2781/25, 917 24 Trnava, SlovakiaFaculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jána Bottu č. 2781/25, 917 24 Trnava, SlovakiaThe aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti3In4) and silver (AgIn2) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg)6In5 and (AgCu)In2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.http://www.mdpi.com/2075-4701/8/4/274solderceramicscopperflux-less soldering |
| spellingShingle | Roman Koleňák Igor Kostolný Jaromír Drápala Martin Sahul Ján Urminský Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper Metals solder ceramics copper flux-less soldering |
| title | Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper |
| title_full | Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper |
| title_fullStr | Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper |
| title_full_unstemmed | Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper |
| title_short | Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper |
| title_sort | characterizing the soldering alloy type in ag ti and the study of direct soldering of sic ceramics and copper |
| topic | solder ceramics copper flux-less soldering |
| url | http://www.mdpi.com/2075-4701/8/4/274 |
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