Modular Architecture of a Non-Contact Pinch Actuation Micropump
This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2012-09-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | http://www.mdpi.com/1424-8220/12/9/12572 |
| _version_ | 1818038233574932480 |
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| author | Ruzairi Abdul Rahim Pei Ling Leow Uda Hashim Tijjani Adam Rashidah Arsat Pei Song Chee |
| author_facet | Ruzairi Abdul Rahim Pei Ling Leow Uda Hashim Tijjani Adam Rashidah Arsat Pei Song Chee |
| author_sort | Ruzairi Abdul Rahim |
| collection | DOAJ |
| description | This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0–5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0–80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. |
| first_indexed | 2024-12-10T07:39:29Z |
| format | Article |
| id | doaj.art-0615c015c904418d93e0e128bdc22299 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-12-10T07:39:29Z |
| publishDate | 2012-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-0615c015c904418d93e0e128bdc222992022-12-22T01:57:20ZengMDPI AGSensors1424-82202012-09-01129125721258710.3390/s120912572Modular Architecture of a Non-Contact Pinch Actuation MicropumpRuzairi Abdul RahimPei Ling LeowUda HashimTijjani AdamRashidah ArsatPei Song CheeThis paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0–5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0–80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz.http://www.mdpi.com/1424-8220/12/9/12572electromagnetic micropumpdiffuserlab on chiphot embossing |
| spellingShingle | Ruzairi Abdul Rahim Pei Ling Leow Uda Hashim Tijjani Adam Rashidah Arsat Pei Song Chee Modular Architecture of a Non-Contact Pinch Actuation Micropump Sensors electromagnetic micropump diffuser lab on chip hot embossing |
| title | Modular Architecture of a Non-Contact Pinch Actuation Micropump |
| title_full | Modular Architecture of a Non-Contact Pinch Actuation Micropump |
| title_fullStr | Modular Architecture of a Non-Contact Pinch Actuation Micropump |
| title_full_unstemmed | Modular Architecture of a Non-Contact Pinch Actuation Micropump |
| title_short | Modular Architecture of a Non-Contact Pinch Actuation Micropump |
| title_sort | modular architecture of a non contact pinch actuation micropump |
| topic | electromagnetic micropump diffuser lab on chip hot embossing |
| url | http://www.mdpi.com/1424-8220/12/9/12572 |
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