Sandwich Face Layer Debonding Detection and Size Estimation by Machine-Learning-Based Evaluation of Electromechanical Impedance Measurements
The present research proposes a two-step physics- and machine-learning(ML)-based electromechanical impedance (EMI) measurement data evaluation approach for sandwich face layer debonding detection and size estimation in structural health monitoring (SHM) applications. As a case example, a circular al...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-03-01
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Series: | Sensors |
Subjects: | |
Online Access: | https://www.mdpi.com/1424-8220/23/6/2910 |