APA (7th ed.) Citation

Tian, W., Li, F., He, M., Ji, H., & Chen, S. (2025). Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration. MDPI AG.

Chicago Style (17th ed.) Citation

Tian, Wenchao, Feiyang Li, Mang He, Haoyue Ji, and Si Chen. Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration. MDPI AG, 2025.

MLA (9th ed.) Citation

Tian, Wenchao, et al. Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration. MDPI AG, 2025.