In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due t...

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Bibliographic Details
Main Authors:	Xin F. Tan, Flora Somidin, Stuart D. McDonald, Michael J. Bermingham, Hiroshi Maeno, Syo Matsumura, Kazuhiro Nogita
Format:	Article
Language:	English
Published:	MDPI AG 2022-01-01
Series:	Materials
Subjects:	Pb-free solders high voltage transmission electron microscopy Cu<sub>6</sub>Sn<sub>5</sub>
Online Access:	https://www.mdpi.com/1996-1944/15/2/510

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