Gallium-effect in a lead-free solder for silver-sheathed superconducting tape
Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn–A...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2021-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ac10d2 |
| Summary: | Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn–Ag–Cu solder, a smooth interfacial Ag _2 Ga layer is uniformly formed on the Ag-sheath surface. As a result, the solder joint achieved a very low joint resistivity of 16 nΩcm ^2 at 40 K. The present gallium-doped lead-free solder can also be applied to general soldering use with Ag materials. |
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| ISSN: | 2053-1591 |