Gallium-effect in a lead-free solder for silver-sheathed superconducting tape
Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn–A...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2021-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ac10d2 |
| _version_ | 1797746853985386496 |
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| author | Shin-Ichi Shamoto Min Kai Lee Yuki Fujimura Keietsu Kondo Takashi U Ito Kazuhiko Ikeuchi Satoshi Yasuda Lieh-Jeng Chang |
| author_facet | Shin-Ichi Shamoto Min Kai Lee Yuki Fujimura Keietsu Kondo Takashi U Ito Kazuhiko Ikeuchi Satoshi Yasuda Lieh-Jeng Chang |
| author_sort | Shin-Ichi Shamoto |
| collection | DOAJ |
| description | Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn–Ag–Cu solder, a smooth interfacial Ag _2 Ga layer is uniformly formed on the Ag-sheath surface. As a result, the solder joint achieved a very low joint resistivity of 16 nΩcm ^2 at 40 K. The present gallium-doped lead-free solder can also be applied to general soldering use with Ag materials. |
| first_indexed | 2024-03-12T15:43:42Z |
| format | Article |
| id | doaj.art-0699a431eb6c4ca5a578c57583aa6c81 |
| institution | Directory Open Access Journal |
| issn | 2053-1591 |
| language | English |
| last_indexed | 2024-03-12T15:43:42Z |
| publishDate | 2021-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj.art-0699a431eb6c4ca5a578c57583aa6c812023-08-09T15:51:25ZengIOP PublishingMaterials Research Express2053-15912021-01-018707630310.1088/2053-1591/ac10d2Gallium-effect in a lead-free solder for silver-sheathed superconducting tapeShin-Ichi Shamoto0https://orcid.org/0000-0001-5496-9640Min Kai Lee1Yuki Fujimura2Keietsu Kondo3Takashi U Ito4Kazuhiko Ikeuchi5Satoshi Yasuda6Lieh-Jeng Chang7Advanced Science Research Center, Japan Atomic Energy Agency, Tokai, Ibaraki 319-1195, Japan; Neutron Science and Technology Center, Comprehensive Research Organization for Science and Society (CROSS), Tokai, Ibaraki 319-1106, Japan; Department of Physics, National Cheng Kung University , Tainan 70101, Taiwan; Meson Science Laboratory, RIKEN, Wako, Saitama 351-0198, JapanDepartment of Physics, National Cheng Kung University , Tainan 70101, TaiwanNuclear Science and Engineering Center, Japan Atomic Energy Agency, Tokai, Naka, Ibaraki 319-1195, JapanNuclear Science and Engineering Center, Japan Atomic Energy Agency, Tokai, Naka, Ibaraki 319-1195, JapanAdvanced Science Research Center, Japan Atomic Energy Agency, Tokai, Ibaraki 319-1195, JapanNeutron Science and Technology Center, Comprehensive Research Organization for Science and Society (CROSS), Tokai, Ibaraki 319-1106, JapanAdvanced Science Research Center, Japan Atomic Energy Agency, Tokai, Ibaraki 319-1195, JapanDepartment of Physics, National Cheng Kung University , Tainan 70101, TaiwanSolder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn–Ag–Cu solder, a smooth interfacial Ag _2 Ga layer is uniformly formed on the Ag-sheath surface. As a result, the solder joint achieved a very low joint resistivity of 16 nΩcm ^2 at 40 K. The present gallium-doped lead-free solder can also be applied to general soldering use with Ag materials.https://doi.org/10.1088/2053-1591/ac10d2gallium-effectlead-free soldersilver-sheathed-superconducting-tape |
| spellingShingle | Shin-Ichi Shamoto Min Kai Lee Yuki Fujimura Keietsu Kondo Takashi U Ito Kazuhiko Ikeuchi Satoshi Yasuda Lieh-Jeng Chang Gallium-effect in a lead-free solder for silver-sheathed superconducting tape Materials Research Express gallium-effect lead-free solder silver-sheathed-superconducting-tape |
| title | Gallium-effect in a lead-free solder for silver-sheathed superconducting tape |
| title_full | Gallium-effect in a lead-free solder for silver-sheathed superconducting tape |
| title_fullStr | Gallium-effect in a lead-free solder for silver-sheathed superconducting tape |
| title_full_unstemmed | Gallium-effect in a lead-free solder for silver-sheathed superconducting tape |
| title_short | Gallium-effect in a lead-free solder for silver-sheathed superconducting tape |
| title_sort | gallium effect in a lead free solder for silver sheathed superconducting tape |
| topic | gallium-effect lead-free solder silver-sheathed-superconducting-tape |
| url | https://doi.org/10.1088/2053-1591/ac10d2 |
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