Interband Cascade Photonic Integrated Circuits on Native III-V Chip

We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for...

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Main Authors: Jerry R. Meyer, Chul Soo Kim, Mijin Kim, Chadwick L. Canedy, Charles D. Merritt, William W. Bewley, Igor Vurgaftman
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Sensors
Subjects:
Online Access:https://www.mdpi.com/1424-8220/21/2/599
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author Jerry R. Meyer
Chul Soo Kim
Mijin Kim
Chadwick L. Canedy
Charles D. Merritt
William W. Bewley
Igor Vurgaftman
author_facet Jerry R. Meyer
Chul Soo Kim
Mijin Kim
Chadwick L. Canedy
Charles D. Merritt
William W. Bewley
Igor Vurgaftman
author_sort Jerry R. Meyer
collection DOAJ
description We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which incorporate both the sensing waveguide and detector into a laser cavity defined by two high-reflectivity cleaved facets. We also describe an edge-emitting laser configuration that optimizes stability by minimizing parasitic feedback from external optical elements, and which can potentially operate with lower drive power than any mid-IR laser now available. While ICL-based PICs processed on GaSb serve to illustrate the various configurations, many of the proposed concepts apply equally to quantum-cascade-laser (QCL)-based PICs processed on InP, and PICs that integrate III-V lasers and detectors on silicon. With mature processing, it should become possible to mass-produce hundreds of individual PICs on the same chip which, when singulated, will realize chemical sensing by an extremely compact and inexpensive package.
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spelling doaj.art-07d961a6d99e42efbccda481fccbabc52023-12-03T13:28:36ZengMDPI AGSensors1424-82202021-01-0121259910.3390/s21020599Interband Cascade Photonic Integrated Circuits on Native III-V ChipJerry R. Meyer0Chul Soo Kim1Mijin Kim2Chadwick L. Canedy3Charles D. Merritt4William W. Bewley5Igor Vurgaftman6Naval Research Laboratory, Code 5613, Washington, DC 20375, USANaval Research Laboratory, Code 5613, Washington, DC 20375, USAJacobs Corporation, Hanover, MD 21076, USANaval Research Laboratory, Code 5613, Washington, DC 20375, USANaval Research Laboratory, Code 5613, Washington, DC 20375, USANaval Research Laboratory, Code 5613, Washington, DC 20375, USANaval Research Laboratory, Code 5613, Washington, DC 20375, USAWe describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which incorporate both the sensing waveguide and detector into a laser cavity defined by two high-reflectivity cleaved facets. We also describe an edge-emitting laser configuration that optimizes stability by minimizing parasitic feedback from external optical elements, and which can potentially operate with lower drive power than any mid-IR laser now available. While ICL-based PICs processed on GaSb serve to illustrate the various configurations, many of the proposed concepts apply equally to quantum-cascade-laser (QCL)-based PICs processed on InP, and PICs that integrate III-V lasers and detectors on silicon. With mature processing, it should become possible to mass-produce hundreds of individual PICs on the same chip which, when singulated, will realize chemical sensing by an extremely compact and inexpensive package.https://www.mdpi.com/1424-8220/21/2/599interband cascade laserphotonic integrated circuitchemical sensingmidwave infrared
spellingShingle Jerry R. Meyer
Chul Soo Kim
Mijin Kim
Chadwick L. Canedy
Charles D. Merritt
William W. Bewley
Igor Vurgaftman
Interband Cascade Photonic Integrated Circuits on Native III-V Chip
Sensors
interband cascade laser
photonic integrated circuit
chemical sensing
midwave infrared
title Interband Cascade Photonic Integrated Circuits on Native III-V Chip
title_full Interband Cascade Photonic Integrated Circuits on Native III-V Chip
title_fullStr Interband Cascade Photonic Integrated Circuits on Native III-V Chip
title_full_unstemmed Interband Cascade Photonic Integrated Circuits on Native III-V Chip
title_short Interband Cascade Photonic Integrated Circuits on Native III-V Chip
title_sort interband cascade photonic integrated circuits on native iii v chip
topic interband cascade laser
photonic integrated circuit
chemical sensing
midwave infrared
url https://www.mdpi.com/1424-8220/21/2/599
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AT chadwicklcanedy interbandcascadephotonicintegratedcircuitsonnativeiiivchip
AT charlesdmerritt interbandcascadephotonicintegratedcircuitsonnativeiiivchip
AT williamwbewley interbandcascadephotonicintegratedcircuitsonnativeiiivchip
AT igorvurgaftman interbandcascadephotonicintegratedcircuitsonnativeiiivchip