Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry
Colored Picosecond Acoustics (CPA) and Spectroscopic Ellipsometry (SE) are combined to measure elastic and thermoelastic properties of polymer thin-film resins deposited on 300 mm wafers. Film thickness and refractive index are measured using SE. Sound velocity and thickness are measured using CPA f...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-06-01
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| Series: | Photoacoustics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2213597923000514 |
| _version_ | 1797801017190907904 |
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| author | A. Devos F. Chevreux C. Licitra A. Chargui L.-L. Chapelon |
| author_facet | A. Devos F. Chevreux C. Licitra A. Chargui L.-L. Chapelon |
| author_sort | A. Devos |
| collection | DOAJ |
| description | Colored Picosecond Acoustics (CPA) and Spectroscopic Ellipsometry (SE) are combined to measure elastic and thermoelastic properties of polymer thin-film resins deposited on 300 mm wafers. Film thickness and refractive index are measured using SE. Sound velocity and thickness are measured using CPA from the refractive index. Comparing the two thicknesses allows checking consistency between both approaches. The same combination is then applied at various temperatures from 19° to 180°C. As the sample is heated, both thickness and sound velocity change. By monitoring these contributions separately, the Temperature Coefficient on sound Velocity (TCV) and the Coefficient on Thermal Expansion are deduced. The protocol is applied to five industrial samples made of different thin-film resins currently used by microelectronic industry. Young’s modulus varies from resin to resin by up to 20%. TCV is large on each resin and varies from one resin to another up to 57%. |
| first_indexed | 2024-03-13T04:44:01Z |
| format | Article |
| id | doaj.art-0866c8e1e5064d4d8fe720997dba6146 |
| institution | Directory Open Access Journal |
| issn | 2213-5979 |
| language | English |
| last_indexed | 2024-03-13T04:44:01Z |
| publishDate | 2023-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Photoacoustics |
| spelling | doaj.art-0866c8e1e5064d4d8fe720997dba61462023-06-19T04:28:04ZengElsevierPhotoacoustics2213-59792023-06-0131100498Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometryA. Devos0F. Chevreux1C. Licitra2A. Chargui3L.-L. Chapelon4IEMN – UMR8250 CNRS, Avenue Poincaré BP 69, 59652 Villeneuve d′Ascq, France; Corresponding author.STMicroelectronics, Crolles, FranceUniv. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FranceIEMN – UMR8250 CNRS, Avenue Poincaré BP 69, 59652 Villeneuve d′Ascq, FranceSTMicroelectronics, Crolles, FranceColored Picosecond Acoustics (CPA) and Spectroscopic Ellipsometry (SE) are combined to measure elastic and thermoelastic properties of polymer thin-film resins deposited on 300 mm wafers. Film thickness and refractive index are measured using SE. Sound velocity and thickness are measured using CPA from the refractive index. Comparing the two thicknesses allows checking consistency between both approaches. The same combination is then applied at various temperatures from 19° to 180°C. As the sample is heated, both thickness and sound velocity change. By monitoring these contributions separately, the Temperature Coefficient on sound Velocity (TCV) and the Coefficient on Thermal Expansion are deduced. The protocol is applied to five industrial samples made of different thin-film resins currently used by microelectronic industry. Young’s modulus varies from resin to resin by up to 20%. TCV is large on each resin and varies from one resin to another up to 57%.http://www.sciencedirect.com/science/article/pii/S2213597923000514Mechanical propertiesPhotoresistResinPicosecond acoustics |
| spellingShingle | A. Devos F. Chevreux C. Licitra A. Chargui L.-L. Chapelon Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry Photoacoustics Mechanical properties Photoresist Resin Picosecond acoustics |
| title | Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry |
| title_full | Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry |
| title_fullStr | Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry |
| title_full_unstemmed | Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry |
| title_short | Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry |
| title_sort | elastic and thermo elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry |
| topic | Mechanical properties Photoresist Resin Picosecond acoustics |
| url | http://www.sciencedirect.com/science/article/pii/S2213597923000514 |
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