Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste
A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesis of the plate-type Cu formate particles from CuO was a...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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Polish Academy of Sciences
2020-07-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | https://journals.pan.pl/Content/116382/PDF/AMM-2020-3-15-Jong-Hyun%20Lee.pdf |
| _version_ | 1811314894462517248 |
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| author | Kyeong Hwan Jo Jong-Hyun Lee |
| author_facet | Kyeong Hwan Jo Jong-Hyun Lee |
| author_sort | Kyeong Hwan Jo |
| collection | DOAJ |
| description | A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesis of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa. |
| first_indexed | 2024-04-13T11:20:33Z |
| format | Article |
| id | doaj.art-09f93f99552f4e5085dd06e79171c91a |
| institution | Directory Open Access Journal |
| issn | 2300-1909 |
| language | English |
| last_indexed | 2024-04-13T11:20:33Z |
| publishDate | 2020-07-01 |
| publisher | Polish Academy of Sciences |
| record_format | Article |
| series | Archives of Metallurgy and Materials |
| spelling | doaj.art-09f93f99552f4e5085dd06e79171c91a2022-12-22T02:48:50ZengPolish Academy of SciencesArchives of Metallurgy and Materials2300-19092020-07-01vol. 65No 310571061https://doi.org/10.24425/amm.2020.133217Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate PasteKyeong Hwan JoJong-Hyun LeeA paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesis of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa.https://journals.pan.pl/Content/116382/PDF/AMM-2020-3-15-Jong-Hyun%20Lee.pdfdie attachcu formate pastesinter bondingcu finishshear strength |
| spellingShingle | Kyeong Hwan Jo Jong-Hyun Lee Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste Archives of Metallurgy and Materials die attach cu formate paste sinter bonding cu finish shear strength |
| title | Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste |
| title_full | Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste |
| title_fullStr | Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste |
| title_full_unstemmed | Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste |
| title_short | Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste |
| title_sort | die attachment method on a cu finish by pressure assisted sinter bonding in air using cu formate paste |
| topic | die attach cu formate paste sinter bonding cu finish shear strength |
| url | https://journals.pan.pl/Content/116382/PDF/AMM-2020-3-15-Jong-Hyun%20Lee.pdf |
| work_keys_str_mv | AT kyeonghwanjo dieattachmentmethodonacufinishbypressureassistedsinterbondinginairusingcuformatepaste AT jonghyunlee dieattachmentmethodonacufinishbypressureassistedsinterbondinginairusingcuformatepaste |