Effect of Joule heating on the reliability of microbumps in 3D IC
Due to the demand for high-performance electronic products, there has been a rapid development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D stacking relies on microbumps and through silicon vias (TSVs) to connect multiple Si dies vertically. These high-performance ele...
| Autores principales: | , , , , , |
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| Formato: | Artículo |
| Lenguaje: | English |
| Publicado: |
Elsevier
2024-07-01
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| Colección: | Journal of Materials Research and Technology |
| Materias: | |
| Acceso en línea: | http://www.sciencedirect.com/science/article/pii/S2238785424015965 |