Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was signifi...
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MDPI AG
2020-08-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/13/17/3739 |
| _version_ | 1797555852635275264 |
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| author | Siming Hua Pingze Zhang Zili Liu Lin Yang |
| author_facet | Siming Hua Pingze Zhang Zili Liu Lin Yang |
| author_sort | Siming Hua |
| collection | DOAJ |
| description | In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was significantly affected by work hardening, dynamic recovery, and dynamic recrystallization. The activation energy Q was 261.649 kJ·mol<sup>−1</sup> and hot compression constitutive equation was determined as <inline-formula><math display="inline"><semantics><mrow><mrow><mtext> </mtext><mover><mi mathvariant="sans-serif">ε</mi><mo>˙</mo></mover></mrow><mo>=</mo><msup><mrow><mrow><mo>[</mo><mrow><mrow><mi>sin</mi><mi mathvariant="normal">h</mi></mrow><mrow><mo>(</mo><mrow><mn>0.00651</mn><mi mathvariant="sans-serif">σ</mi></mrow><mo>)</mo></mrow></mrow><mo>]</mo></mrow></mrow><mrow><mn>10.2378</mn></mrow></msup><mi>·</mi><mi>exp</mi><mrow><mo>(</mo><mrow><mn>33.6656</mn><mo>−</mo><mfrac><mrow><mn>261.649</mn></mrow><mrow><mi>RT</mi></mrow></mfrac></mrow><mo>)</mo></mrow><mo>.</mo></mrow></semantics></math></inline-formula> The microstructural evolution of the alloy during deformation at 400 °C revealed the presence of both slip and shear bands in the grains. At 700 °C, dynamic recrystallization grains were observed, but recrystallization was incomplete. In summary, these results provide the theoretical basis for the continuous extrusion process of alloys with promising application prospects in the future. |
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| last_indexed | 2024-03-10T16:53:32Z |
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| series | Materials |
| spelling | doaj.art-0c3ffa5dd9784a8aa7c71db57fb96c992023-11-20T11:11:47ZengMDPI AGMaterials1996-19442020-08-011317373910.3390/ma13173739Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by UpcastingSiming Hua0Pingze Zhang1Zili Liu2Lin Yang3College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210000, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210000, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210000, ChinaChina Railway Construction Electrification Bureau Group Kangyuan New Material Co., Ltd., Jinjiang 214500, ChinaIn this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was significantly affected by work hardening, dynamic recovery, and dynamic recrystallization. The activation energy Q was 261.649 kJ·mol<sup>−1</sup> and hot compression constitutive equation was determined as <inline-formula><math display="inline"><semantics><mrow><mrow><mtext> </mtext><mover><mi mathvariant="sans-serif">ε</mi><mo>˙</mo></mover></mrow><mo>=</mo><msup><mrow><mrow><mo>[</mo><mrow><mrow><mi>sin</mi><mi mathvariant="normal">h</mi></mrow><mrow><mo>(</mo><mrow><mn>0.00651</mn><mi mathvariant="sans-serif">σ</mi></mrow><mo>)</mo></mrow></mrow><mo>]</mo></mrow></mrow><mrow><mn>10.2378</mn></mrow></msup><mi>·</mi><mi>exp</mi><mrow><mo>(</mo><mrow><mn>33.6656</mn><mo>−</mo><mfrac><mrow><mn>261.649</mn></mrow><mrow><mi>RT</mi></mrow></mfrac></mrow><mo>)</mo></mrow><mo>.</mo></mrow></semantics></math></inline-formula> The microstructural evolution of the alloy during deformation at 400 °C revealed the presence of both slip and shear bands in the grains. At 700 °C, dynamic recrystallization grains were observed, but recrystallization was incomplete. In summary, these results provide the theoretical basis for the continuous extrusion process of alloys with promising application prospects in the future.https://www.mdpi.com/1996-1944/13/17/3739Cu–Sn–La alloystress–straindynamic recrystallizationhot deformationconstitutive equation |
| spellingShingle | Siming Hua Pingze Zhang Zili Liu Lin Yang Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting Materials Cu–Sn–La alloy stress–strain dynamic recrystallization hot deformation constitutive equation |
| title | Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting |
| title_full | Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting |
| title_fullStr | Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting |
| title_full_unstemmed | Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting |
| title_short | Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting |
| title_sort | hot deformation behavior of cu sn la polycrystalline alloy prepared by upcasting |
| topic | Cu–Sn–La alloy stress–strain dynamic recrystallization hot deformation constitutive equation |
| url | https://www.mdpi.com/1996-1944/13/17/3739 |
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