Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate

Titanium (Ti) film has been used as a hydrogen storage material. The effect of the thickness of a molybdenum (Mo) nano-interlayer on the cohesive strength between a Mo/Ti multilayer film and a single crystal silicon (Si) substrate was investigated by X-ray diffraction (XRD), scanning electron micros...

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Main Authors: Huahai Shen, Bing Yao, Jianwei Zhang, Xinqiao Zhu, Xia Xiang, Xiaosong Zhou, Xiaotao Zu
Format: Article
Language:English
Published: MDPI AG 2019-04-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/9/4/616
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author Huahai Shen
Bing Yao
Jianwei Zhang
Xinqiao Zhu
Xia Xiang
Xiaosong Zhou
Xiaotao Zu
author_facet Huahai Shen
Bing Yao
Jianwei Zhang
Xinqiao Zhu
Xia Xiang
Xiaosong Zhou
Xiaotao Zu
author_sort Huahai Shen
collection DOAJ
description Titanium (Ti) film has been used as a hydrogen storage material. The effect of the thickness of a molybdenum (Mo) nano-interlayer on the cohesive strength between a Mo/Ti multilayer film and a single crystal silicon (Si) substrate was investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), and nano-indenter. Four groups of Si/Mo/Ti multilayer films with different thicknesses of Mo and Ti films were fabricated. The XRD results showed that the introduction of the Mo layer suppressed the chemical reaction between the Ti film and Si substrate. The nano-indenter scratch results demonstrated that the cohesion between the Mo/Ti film and Si substrate decreased significantly with increasing Mo interlayer thickness. The XRD stress analysis indicated that the residual stress in the Si/Mo/Ti film was in-plane tensile stress which might be due to the lattice expansion at a high film growth temperature of 700 °C and the discrepancy of the thermal expansion coefficient between the Ti film and Si substrate. The tensile stress in the Si/Mo/Ti film decreased with increasing Mo interlayer thickness. During the cooling of the Si substrate, a greater decrease in tensile stress occurred for the thicker Mo interlayer sample, which became the driving force for reducing the cohesion between the Mo/Ti film and Si substrate. The results confirmed that the design of the Mo interlayer played an important role in the quality of the Ti film grown on Si substrate.
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spelling doaj.art-0cb57d1631554d7b87c7670fdcd0a1342022-12-21T20:47:53ZengMDPI AGNanomaterials2079-49912019-04-019461610.3390/nano9040616nano9040616Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon SubstrateHuahai Shen0Bing Yao1Jianwei Zhang2Xinqiao Zhu3Xia Xiang4Xiaosong Zhou5Xiaotao Zu6Institute of Nuclear Physics and Chemistry, China Academy of Engineering Physics, Mianyang 621900, ChinaInstitute of Nuclear Physics and Chemistry, China Academy of Engineering Physics, Mianyang 621900, ChinaSchool of Physics, University of Electronic Science and Technology of China, Chengdu 610054, ChinaInstitute of Nuclear Physics and Chemistry, China Academy of Engineering Physics, Mianyang 621900, ChinaSchool of Physics, University of Electronic Science and Technology of China, Chengdu 610054, ChinaInstitute of Nuclear Physics and Chemistry, China Academy of Engineering Physics, Mianyang 621900, ChinaSchool of Physics, University of Electronic Science and Technology of China, Chengdu 610054, ChinaTitanium (Ti) film has been used as a hydrogen storage material. The effect of the thickness of a molybdenum (Mo) nano-interlayer on the cohesive strength between a Mo/Ti multilayer film and a single crystal silicon (Si) substrate was investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), and nano-indenter. Four groups of Si/Mo/Ti multilayer films with different thicknesses of Mo and Ti films were fabricated. The XRD results showed that the introduction of the Mo layer suppressed the chemical reaction between the Ti film and Si substrate. The nano-indenter scratch results demonstrated that the cohesion between the Mo/Ti film and Si substrate decreased significantly with increasing Mo interlayer thickness. The XRD stress analysis indicated that the residual stress in the Si/Mo/Ti film was in-plane tensile stress which might be due to the lattice expansion at a high film growth temperature of 700 °C and the discrepancy of the thermal expansion coefficient between the Ti film and Si substrate. The tensile stress in the Si/Mo/Ti film decreased with increasing Mo interlayer thickness. During the cooling of the Si substrate, a greater decrease in tensile stress occurred for the thicker Mo interlayer sample, which became the driving force for reducing the cohesion between the Mo/Ti film and Si substrate. The results confirmed that the design of the Mo interlayer played an important role in the quality of the Ti film grown on Si substrate.https://www.mdpi.com/2079-4991/9/4/616titanium filminterlayercohesionresidual stressnano-indenter
spellingShingle Huahai Shen
Bing Yao
Jianwei Zhang
Xinqiao Zhu
Xia Xiang
Xiaosong Zhou
Xiaotao Zu
Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate
Nanomaterials
titanium film
interlayer
cohesion
residual stress
nano-indenter
title Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate
title_full Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate
title_fullStr Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate
title_full_unstemmed Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate
title_short Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate
title_sort effect of thickness of molybdenum nano interlayer on cohesion between molybdenum titanium multilayer film and silicon substrate
topic titanium film
interlayer
cohesion
residual stress
nano-indenter
url https://www.mdpi.com/2079-4991/9/4/616
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