Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties
Precusor EHO(3-ethyl-3-hydroxymethyloxetane) was synthesized with diethyl carbonate and trihydroxypropane as the main raw materials. Intermediate AllyEHO(3-ethyl-3-allylmethoxyoxetane) was synthesized with 3-ethyl-3-hydroxymethyloxetane and allyl bromide as the main raw materials. Prepolymer bis[(3-...
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| Format: | Article |
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MDPI AG
2021-08-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/13/15/2573 |
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| author | Yuansheng Liu Biwu Huang Wenbin Zhou Weiqing Chen Yang Wu |
| author_facet | Yuansheng Liu Biwu Huang Wenbin Zhou Weiqing Chen Yang Wu |
| author_sort | Yuansheng Liu |
| collection | DOAJ |
| description | Precusor EHO(3-ethyl-3-hydroxymethyloxetane) was synthesized with diethyl carbonate and trihydroxypropane as the main raw materials. Intermediate AllyEHO(3-ethyl-3-allylmethoxyoxetane) was synthesized with 3-ethyl-3-hydroxymethyloxetane and allyl bromide as the main raw materials. Prepolymer bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane was synthesized with 3-ethyl-3-methoxyoxetane)propyl and diphenylsilane. Photoinitiator triarylsulfonium hexafluoroantimonate of 3% was added to the prepolymer, and a novel kind of the photosensitive resin was prepared. They were analyzed and characterized with FTIR and <sup>1</sup>H-NMR. Photo-DSC examination revealed that the bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane has great photosensitivity. The thermal properties and mechanical properties of the photosensitive resin were examined by TGA and a microcomputer-controlled universal material testing machine, with thermal stabilities of up to 446 °C. The tensile strength was 75.5 MPa and the bending strength was 49.5 MPa. The light transmittance remained above 98%. |
| first_indexed | 2024-03-10T09:09:48Z |
| format | Article |
| id | doaj.art-0d1a59b11e234bbcb6de434b034d28dd |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-10T09:09:48Z |
| publishDate | 2021-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-0d1a59b11e234bbcb6de434b034d28dd2023-11-22T06:04:57ZengMDPI AGPolymers2073-43602021-08-011315257310.3390/polym13152573Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material PropertiesYuansheng Liu0Biwu Huang1Wenbin Zhou2Weiqing Chen3Yang Wu4School of Materials Science and Engineering, Nanchang University, Nanchang 330031, ChinaSchool of Materials Science and Engineering, Nanchang University, Nanchang 330031, ChinaSchool of Materials Science and Engineering, Nanchang University, Nanchang 330031, ChinaSchool of Materials Science and Engineering, Nanchang University, Nanchang 330031, ChinaSchool of Materials Science and Engineering, Nanchang University, Nanchang 330031, ChinaPrecusor EHO(3-ethyl-3-hydroxymethyloxetane) was synthesized with diethyl carbonate and trihydroxypropane as the main raw materials. Intermediate AllyEHO(3-ethyl-3-allylmethoxyoxetane) was synthesized with 3-ethyl-3-hydroxymethyloxetane and allyl bromide as the main raw materials. Prepolymer bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane was synthesized with 3-ethyl-3-methoxyoxetane)propyl and diphenylsilane. Photoinitiator triarylsulfonium hexafluoroantimonate of 3% was added to the prepolymer, and a novel kind of the photosensitive resin was prepared. They were analyzed and characterized with FTIR and <sup>1</sup>H-NMR. Photo-DSC examination revealed that the bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane has great photosensitivity. The thermal properties and mechanical properties of the photosensitive resin were examined by TGA and a microcomputer-controlled universal material testing machine, with thermal stabilities of up to 446 °C. The tensile strength was 75.5 MPa and the bending strength was 49.5 MPa. The light transmittance remained above 98%.https://www.mdpi.com/2073-4360/13/15/2573UV curingphotosensitive resinhydrosilylation reaction |
| spellingShingle | Yuansheng Liu Biwu Huang Wenbin Zhou Weiqing Chen Yang Wu Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties Polymers UV curing photosensitive resin hydrosilylation reaction |
| title | Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties |
| title_full | Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties |
| title_fullStr | Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties |
| title_full_unstemmed | Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties |
| title_short | Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties |
| title_sort | preparation of bis 3 ethyl 3 methoxyoxetane propyl diphenylsilane and investigation of its cationic uv curing material properties |
| topic | UV curing photosensitive resin hydrosilylation reaction |
| url | https://www.mdpi.com/2073-4360/13/15/2573 |
| work_keys_str_mv | AT yuanshengliu preparationofbis3ethyl3methoxyoxetanepropyldiphenylsilaneandinvestigationofitscationicuvcuringmaterialproperties AT biwuhuang preparationofbis3ethyl3methoxyoxetanepropyldiphenylsilaneandinvestigationofitscationicuvcuringmaterialproperties AT wenbinzhou preparationofbis3ethyl3methoxyoxetanepropyldiphenylsilaneandinvestigationofitscationicuvcuringmaterialproperties AT weiqingchen preparationofbis3ethyl3methoxyoxetanepropyldiphenylsilaneandinvestigationofitscationicuvcuringmaterialproperties AT yangwu preparationofbis3ethyl3methoxyoxetanepropyldiphenylsilaneandinvestigationofitscationicuvcuringmaterialproperties |