Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing
In this research, the effects of fumed silica (FS) on the Ultraviolet (UV)-ink rheological behavior and processing windows were discussed. Objects using different concentrations of FS inks were printed by the modified UV-Direct ink writing (DIW) printer. The function of fumed silica in the ink-based...
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-07-01
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| Series: | Polymers |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4360/14/15/3107 |
| _version_ | 1797412545748795392 |
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| author | Fengze Jiang Mingyong Zhou Dietmar Drummer |
| author_facet | Fengze Jiang Mingyong Zhou Dietmar Drummer |
| author_sort | Fengze Jiang |
| collection | DOAJ |
| description | In this research, the effects of fumed silica (FS) on the Ultraviolet (UV)-ink rheological behavior and processing windows were discussed. Objects using different concentrations of FS inks were printed by the modified UV-Direct ink writing (DIW) printer. The function of fumed silica in the ink-based system has been verified, and the processing scope has been expended with a suitable amount of FS combined with the UV light. The results show that the combination of a suitable amount of FS with the UV-DIW system reaches fast and accurate printing with a larger processing window compared to the non-UV system. However, an excessively high concentration of FS will increase the yield stress of the ink, which also increases the requirement of extrusion unit and the die-swelling effects. |
| first_indexed | 2024-03-09T05:03:39Z |
| format | Article |
| id | doaj.art-0df76f6a048945ffb48632343df1a6e6 |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-09T05:03:39Z |
| publishDate | 2022-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-0df76f6a048945ffb48632343df1a6e62023-12-03T12:56:38ZengMDPI AGPolymers2073-43602022-07-011415310710.3390/polym14153107Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink WritingFengze Jiang0Mingyong Zhou1Dietmar Drummer2Institute of Polymer Technology (LKT), Friedrich-Alexander-University Erlangen-Nuremberg, Am Weichselgarten 10, 91058 Erlangen, GermanyCollege of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaInstitute of Polymer Technology (LKT), Friedrich-Alexander-University Erlangen-Nuremberg, Am Weichselgarten 10, 91058 Erlangen, GermanyIn this research, the effects of fumed silica (FS) on the Ultraviolet (UV)-ink rheological behavior and processing windows were discussed. Objects using different concentrations of FS inks were printed by the modified UV-Direct ink writing (DIW) printer. The function of fumed silica in the ink-based system has been verified, and the processing scope has been expended with a suitable amount of FS combined with the UV light. The results show that the combination of a suitable amount of FS with the UV-DIW system reaches fast and accurate printing with a larger processing window compared to the non-UV system. However, an excessively high concentration of FS will increase the yield stress of the ink, which also increases the requirement of extrusion unit and the die-swelling effects.https://www.mdpi.com/2073-4360/14/15/3107rheologythixotropic behaviorUV curingdirect ink writingadditive manufacturing |
| spellingShingle | Fengze Jiang Mingyong Zhou Dietmar Drummer Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing Polymers rheology thixotropic behavior UV curing direct ink writing additive manufacturing |
| title | Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing |
| title_full | Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing |
| title_fullStr | Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing |
| title_full_unstemmed | Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing |
| title_short | Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing |
| title_sort | effects of fumed silica on thixotropic behavior and processing window by uv assisted direct ink writing |
| topic | rheology thixotropic behavior UV curing direct ink writing additive manufacturing |
| url | https://www.mdpi.com/2073-4360/14/15/3107 |
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