Particle Technology in Chemical Mechanical Planarization
In order to keep pace with Moore’s law, multilevel metallization has become the process of choice. Having a planar wafer surface before every successive step in multilevel metallization is important. The Chemical Mechanical Planarization (CMP)...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Hosokawa Powder Technology Foundation
2014-03-01
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| Series: | KONA Powder and Particle Journal |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/kona/25/0/25_2007010/_pdf/-char/en |