Study on the Preparation and Performance of Self-Regressive Fixed Abrasive Chemical Mechanical Polishing Pad

Study on the Preparation and Performance of Self-Regressive Fixed Abrasive Chemical Mechanical Polishing Pad

Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put forward for ultra-precision machining. As an imp...

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Bibliographic Details
Main Authors: Jianguo Yao, Haixu Liu, Zhankui Wang, Yongwei Zhu, Jianxiu Su
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Machines
Subjects:
self-concession
chemical mechanical polishing
consolidated abrasive particles
light curing
polishing pad
Online Access:https://www.mdpi.com/2075-1702/10/11/999

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