Simulation Study on Nanofluid Heat Transfer in Immersion Liquid-Cooled Server

In order to study the application of nanofluids for enhancing heat transfer in the field of liquid-cooled data centers, a mathematical and physical model of liquid-cooled servers was established in this paper. FC–40 was used as the server cooling liquid base, and simulation studies were conducted on...

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Bibliographic Details
Main Authors: Shuai Wen, Gang Chen, Qiao Wu, Yaming Liu
Format: Article
Language:English
Published: MDPI AG 2023-06-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/13/13/7575
Description
Summary:In order to study the application of nanofluids for enhancing heat transfer in the field of liquid-cooled data centers, a mathematical and physical model of liquid-cooled servers was established in this paper. FC–40 was used as the server cooling liquid base, and simulation studies were conducted on the flow and heat transfer of five types of nanofluid: Cu–FC40, CuO–FC40, Al–FC40, Al<sub>2</sub>O<sub>3</sub>–FC40, and TiO<sub>2</sub>–FC40. The results showed that using Al–FC40 nanofluids as the cooling medium had the best heat transfer effect. Under the same operating conditions, the average Nusselt number <i>Nu</i> and friction resistance coefficient <i>f</i> of five types of nanofluid were analyzed, and the heat transfer state of Al–FC40 nanofluid had the smallest <i>f</i>. Further analysis was conducted on the influence of ‘nanoparticle volume fraction’ <i>α</i> and ‘server inlet flow rate’ <i>u</i> on fluid flow and heat transfer. Our research found that an increase in <i>α</i> and the acceleration of <i>u</i> can effectively reduce the surface temperature of server components. As <i>u</i> increases, <i>Nu</i> gradually increases and <i>f</i> generally decreases, but the amplitude of the increase and decrease becomes smoother.
ISSN:2076-3417