Impact of Grinding of Printed Circuit Boards on the Efficiency of Metal Recovery by Means of Electrostatic Separation

Impact of Grinding of Printed Circuit Boards on the Efficiency of Metal Recovery by Means of Electrostatic Separation

This paper analyses the impact of the method of grinding printed circuit boards (PCBs) in a knife mill on the efficiency and purity of products obtained during electrostatic separation. The separated metals and plastics and ceramics can be used as secondary raw materials. This is in line with the pr...

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Bibliographic Details
Main Authors:	Tomasz Suponik, Dawid M. Franke, Paweł M. Nuckowski, Piotr Matusiak, Daniel Kowol, Barbara Tora
Format:	Article
Language:	English
Published:	MDPI AG 2021-03-01
Series:	Minerals
Subjects:	metals recovery printed circuit board cryogenic grinding electrostatic separation atomic emission spectroscopy scanning electron microscopy (SEM)
Online Access:	https://www.mdpi.com/2075-163X/11/3/281

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