Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films
Thin copper films were electrodeposited on a polycrystalline coldrolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-prop...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Faculty of Technical Sciences in Cacak
2017-01-01
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| Series: | Serbian Journal of Electrical Engineering |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/1451-4869/2017/1451-48691701001M.pdf |
| Summary: | Thin copper films were electrodeposited on a polycrystalline coldrolled
copper substrate. The composition of the laboratory-made copper sulphate
electrolyte was changed by the addition of various additives. The influence
of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane
sulfonic acid (MPSA) on mechanical and adhesion properties of the
electrodeposited copper films was investigated using Vickers microindentation
technique. Calculations of the film hardness and adhesion were carried out
using composite hardness models of Korsunsky and Chen-Gao. The hardness of
the composite system is influenced by the adhesion of the copper film to the
substrate. Increasing adhesion corresponds to increasing values of the
calculated adhesion parameter b, named the critical reduced depth. When
additives are added to a plating solution, the copper deposition mechanism is
changed and fine-grained microstructure without the formation of microscopic
nodules is obtained. [Project of the Serbian Ministry of Education, Science
and Technological Development, Grant no. TR 32008, Grant no. TR 34011 and
Grant no. III 45019] |
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| ISSN: | 1451-4869 2217-7183 |