The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction

The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction

This study aimed to investigate the effects of the addition of Bi and Zn on the mechanical properties of Sn-Ag-Cu lead-free alloy frequently used as a soldering material in the semiconductor packaging process. To reduce the Ag content of the commercial alloy SAC305 (Sn-3Ag-0.5Cu) by 1 wt.%, Bi and Z...

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Bibliographic Details
Main Authors: Yubin Kang, Jin-Ju Choi, Dae-Guen Kim, Hyun-Woo Shim
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Metals
Subjects:
Sn-Ag-Cu alloys
lead-free solder alloys
SAC305
Zn
Bi
Online Access:https://www.mdpi.com/2075-4701/12/8/1245

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