A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
A novel bonding process using Ag agglomerates paste prepared by Ag<sub>2</sub>O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag<sub>2</sub>O sintering process for Cu–Cu bonding. By applying the Ag agglomerate paste to Ag–...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-05-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/12/5/521 |