Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components
As a feasibility study, a direct ink writing process using a conventional FDM-printer and colloidal C–SiC pastes was developed. The pastes have a low content of organic additives, which enables the omission of a pyrolysis step, i.e. the green parts can undergo the liquid silicon infiltration process...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-03-01
|
| Series: | Open Ceramics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666539520300547 |
| _version_ | 1818647510093135872 |
|---|---|
| author | Alexander Held Georg Puchas Ferdinand Müller Walter Krenkel |
| author_facet | Alexander Held Georg Puchas Ferdinand Müller Walter Krenkel |
| author_sort | Alexander Held |
| collection | DOAJ |
| description | As a feasibility study, a direct ink writing process using a conventional FDM-printer and colloidal C–SiC pastes was developed. The pastes have a low content of organic additives, which enables the omission of a pyrolysis step, i.e. the green parts can undergo the liquid silicon infiltration process directly after drying.The rheological behavior of the pastes was investigated regarding their viscosity, thixotropy and yield point. By analyzing important effects of 3D-printing, such as bridging and the possibility to print overhangs, the printability was determined. The near-net shape ability of the process was studied by comparing the dimensions after each processing step.The microstructure of the samples showed no detectable microstructural anomalies in this interface area. The phase analysis of the samples showed no residual carbon in the SiSiC parts. Printed SiSiC parts reached flexural strengths of 190 MPa, a hardness of 15.7 GPa and a Young’s Modulus of 246 GPa. |
| first_indexed | 2024-12-17T01:03:40Z |
| format | Article |
| id | doaj.art-11290f469f844d138c76f66a201f7da8 |
| institution | Directory Open Access Journal |
| issn | 2666-5395 |
| language | English |
| last_indexed | 2024-12-17T01:03:40Z |
| publishDate | 2021-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Open Ceramics |
| spelling | doaj.art-11290f469f844d138c76f66a201f7da82022-12-21T22:09:21ZengElsevierOpen Ceramics2666-53952021-03-015100054Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC componentsAlexander Held0Georg Puchas1Ferdinand Müller2Walter Krenkel3Corresponding author.; University of Bayreuth, Department of Ceramic Materials Engineering, Prof.-Rüdiger-Bormann-Str. 1, D-95447, Bayreuth, GermanyUniversity of Bayreuth, Department of Ceramic Materials Engineering, Prof.-Rüdiger-Bormann-Str. 1, D-95447, Bayreuth, GermanyUniversity of Bayreuth, Department of Ceramic Materials Engineering, Prof.-Rüdiger-Bormann-Str. 1, D-95447, Bayreuth, GermanyUniversity of Bayreuth, Department of Ceramic Materials Engineering, Prof.-Rüdiger-Bormann-Str. 1, D-95447, Bayreuth, GermanyAs a feasibility study, a direct ink writing process using a conventional FDM-printer and colloidal C–SiC pastes was developed. The pastes have a low content of organic additives, which enables the omission of a pyrolysis step, i.e. the green parts can undergo the liquid silicon infiltration process directly after drying.The rheological behavior of the pastes was investigated regarding their viscosity, thixotropy and yield point. By analyzing important effects of 3D-printing, such as bridging and the possibility to print overhangs, the printability was determined. The near-net shape ability of the process was studied by comparing the dimensions after each processing step.The microstructure of the samples showed no detectable microstructural anomalies in this interface area. The phase analysis of the samples showed no residual carbon in the SiSiC parts. Printed SiSiC parts reached flexural strengths of 190 MPa, a hardness of 15.7 GPa and a Young’s Modulus of 246 GPa.http://www.sciencedirect.com/science/article/pii/S2666539520300547Colloidal inksAdditive manufacturingDirect ink writingSiSiCLiquid silicon infiltrationNear-net shape |
| spellingShingle | Alexander Held Georg Puchas Ferdinand Müller Walter Krenkel Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components Open Ceramics Colloidal inks Additive manufacturing Direct ink writing SiSiC Liquid silicon infiltration Near-net shape |
| title | Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components |
| title_full | Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components |
| title_fullStr | Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components |
| title_full_unstemmed | Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components |
| title_short | Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components |
| title_sort | direct ink writing of water based c sic pastes for the manufacturing of sisic components |
| topic | Colloidal inks Additive manufacturing Direct ink writing SiSiC Liquid silicon infiltration Near-net shape |
| url | http://www.sciencedirect.com/science/article/pii/S2666539520300547 |
| work_keys_str_mv | AT alexanderheld directinkwritingofwaterbasedcsicpastesforthemanufacturingofsisiccomponents AT georgpuchas directinkwritingofwaterbasedcsicpastesforthemanufacturingofsisiccomponents AT ferdinandmuller directinkwritingofwaterbasedcsicpastesforthemanufacturingofsisiccomponents AT walterkrenkel directinkwritingofwaterbasedcsicpastesforthemanufacturingofsisiccomponents |