Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder
Sn-0.7Cu-based (all in wt.% unless specified otherwise) composite solders functionalized with Ni-coated carbon nanotubes (CNTs) with various weight proportions ranging from 0.01 to 0.2 wt.% were successfully produced. The Ni-coated CNTs were synthesized with discontinuous nickel coating by an improv...
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| Format: | Article |
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MDPI AG
2022-07-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/12/7/1196 |
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| author | Xin Liu Guoge Lu Zhe Ji Fuxiang Wei Chuandang Yao Jiajian Wang |
| author_facet | Xin Liu Guoge Lu Zhe Ji Fuxiang Wei Chuandang Yao Jiajian Wang |
| author_sort | Xin Liu |
| collection | DOAJ |
| description | Sn-0.7Cu-based (all in wt.% unless specified otherwise) composite solders functionalized with Ni-coated carbon nanotubes (CNTs) with various weight proportions ranging from 0.01 to 0.2 wt.% were successfully produced. The Ni-coated CNTs were synthesized with discontinuous nickel coating by an improved electroless nickel plating technique. The microstructural, melting and wetting properties of Sn-0.7Cu-based composite solders were evaluated as a function of different amounts of Ni-coated CNTs addition. Compared to Sn-0.7Cu, it was observed that the microstructure of the composite solder added to the Ni-coated CNTs was still composed of the intermetallic compound Cu<sub>6</sub>Sn<sub>5</sub> in a β-Sn matrix, but the micromorphology changed greatly. When 0.05 wt.% Ni-coated CNTs were added, the rod-shaped Cu<sub>6</sub>Sn<sub>5</sub> particles disappeared, and all appeared in a form of dot-shaped Cu<sub>6</sub>Sn<sub>5</sub> particles. DSC results showed only a slight decrease in the melting behavior of the composite solder. Experimental results unveiled that the addition of Ni-coated CNTs to Sn-0.7Cu solder could improve the wettability. With the addition of 0.05 wt.% Ni-coated CNTs, the wetting angle decreased by 13.35%, and an optimum wetting angle of 25.44° was achieved. |
| first_indexed | 2024-03-09T13:22:01Z |
| format | Article |
| id | doaj.art-113f0ce687214fd5847cac58efa201ea |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-09T13:22:01Z |
| publishDate | 2022-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-113f0ce687214fd5847cac58efa201ea2023-11-30T21:28:09ZengMDPI AGMetals2075-47012022-07-01127119610.3390/met12071196Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite SolderXin Liu0Guoge Lu1Zhe Ji2Fuxiang Wei3Chuandang Yao4Jiajian Wang5China Nuclear Power Operation Technology Co., Ltd., Wuhan 430223, ChinaSchool of Materials and Physics, China University of Mining and Technology, Xuzhou 221116, ChinaSchool of Materials and Physics, China University of Mining and Technology, Xuzhou 221116, ChinaSchool of Materials and Physics, China University of Mining and Technology, Xuzhou 221116, ChinaChina Nuclear Power Operation Technology Co., Ltd., Wuhan 430223, ChinaChina Nuclear Power Operation Technology Co., Ltd., Wuhan 430223, ChinaSn-0.7Cu-based (all in wt.% unless specified otherwise) composite solders functionalized with Ni-coated carbon nanotubes (CNTs) with various weight proportions ranging from 0.01 to 0.2 wt.% were successfully produced. The Ni-coated CNTs were synthesized with discontinuous nickel coating by an improved electroless nickel plating technique. The microstructural, melting and wetting properties of Sn-0.7Cu-based composite solders were evaluated as a function of different amounts of Ni-coated CNTs addition. Compared to Sn-0.7Cu, it was observed that the microstructure of the composite solder added to the Ni-coated CNTs was still composed of the intermetallic compound Cu<sub>6</sub>Sn<sub>5</sub> in a β-Sn matrix, but the micromorphology changed greatly. When 0.05 wt.% Ni-coated CNTs were added, the rod-shaped Cu<sub>6</sub>Sn<sub>5</sub> particles disappeared, and all appeared in a form of dot-shaped Cu<sub>6</sub>Sn<sub>5</sub> particles. DSC results showed only a slight decrease in the melting behavior of the composite solder. Experimental results unveiled that the addition of Ni-coated CNTs to Sn-0.7Cu solder could improve the wettability. With the addition of 0.05 wt.% Ni-coated CNTs, the wetting angle decreased by 13.35%, and an optimum wetting angle of 25.44° was achieved.https://www.mdpi.com/2075-4701/12/7/1196Ni-coated CNTsSn-0.7Cucomposite solderwettability |
| spellingShingle | Xin Liu Guoge Lu Zhe Ji Fuxiang Wei Chuandang Yao Jiajian Wang Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder Metals Ni-coated CNTs Sn-0.7Cu composite solder wettability |
| title | Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder |
| title_full | Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder |
| title_fullStr | Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder |
| title_full_unstemmed | Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder |
| title_short | Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder |
| title_sort | effect of ni coated carbon nanotubes additions on the eutectic sn 0 7cu lead free composite solder |
| topic | Ni-coated CNTs Sn-0.7Cu composite solder wettability |
| url | https://www.mdpi.com/2075-4701/12/7/1196 |
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