Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices
Minimizing patient risk to thermal failure in wearable electronics typically requires complex circuit control, sensors, or passive materials. Here, Yoo et al. present an active materials system with a self-inflating bladder that delaminates upon excessive heat, mitigating the risk of thermal injury.
| Main Authors: | , , , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2023-02-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-023-36690-y |
| _version_ | 1797864062886871040 |
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| author | Seonggwang Yoo Tianyu Yang Minsu Park Hyoyoung Jeong Young Joong Lee Donghwi Cho Joohee Kim Sung Soo Kwak Jaeho Shin Yoonseok Park Yue Wang Nenad Miljkovic William P. King John A. Rogers |
| author_facet | Seonggwang Yoo Tianyu Yang Minsu Park Hyoyoung Jeong Young Joong Lee Donghwi Cho Joohee Kim Sung Soo Kwak Jaeho Shin Yoonseok Park Yue Wang Nenad Miljkovic William P. King John A. Rogers |
| author_sort | Seonggwang Yoo |
| collection | DOAJ |
| description | Minimizing patient risk to thermal failure in wearable electronics typically requires complex circuit control, sensors, or passive materials. Here, Yoo et al. present an active materials system with a self-inflating bladder that delaminates upon excessive heat, mitigating the risk of thermal injury. |
| first_indexed | 2024-04-09T22:46:37Z |
| format | Article |
| id | doaj.art-11759b04e6ef45c28692c5cdfd4987a8 |
| institution | Directory Open Access Journal |
| issn | 2041-1723 |
| language | English |
| last_indexed | 2024-04-09T22:46:37Z |
| publishDate | 2023-02-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Nature Communications |
| spelling | doaj.art-11759b04e6ef45c28692c5cdfd4987a82023-03-22T11:48:40ZengNature PortfolioNature Communications2041-17232023-02-011411910.1038/s41467-023-36690-yResponsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devicesSeonggwang Yoo0Tianyu Yang1Minsu Park2Hyoyoung Jeong3Young Joong Lee4Donghwi Cho5Joohee Kim6Sung Soo Kwak7Jaeho Shin8Yoonseok Park9Yue Wang10Nenad Miljkovic11William P. King12John A. Rogers13Querrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityDepartment of Advanced Materials Engineering for Information and Electronics, Kyung Hee UniversityQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-ChampaignDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-ChampaignQuerrey Simpson Institute for Bioelectronics, Northwestern UniversityMinimizing patient risk to thermal failure in wearable electronics typically requires complex circuit control, sensors, or passive materials. Here, Yoo et al. present an active materials system with a self-inflating bladder that delaminates upon excessive heat, mitigating the risk of thermal injury.https://doi.org/10.1038/s41467-023-36690-y |
| spellingShingle | Seonggwang Yoo Tianyu Yang Minsu Park Hyoyoung Jeong Young Joong Lee Donghwi Cho Joohee Kim Sung Soo Kwak Jaeho Shin Yoonseok Park Yue Wang Nenad Miljkovic William P. King John A. Rogers Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices Nature Communications |
| title | Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices |
| title_full | Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices |
| title_fullStr | Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices |
| title_full_unstemmed | Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices |
| title_short | Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices |
| title_sort | responsive materials and mechanisms as thermal safety systems for skin interfaced electronic devices |
| url | https://doi.org/10.1038/s41467-023-36690-y |
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