Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure
Abstract 3D Cu current collectors have been demonstrated to improve the cycling stability of Li metal anodes, however, the role of their interfacial structure for Li deposition pattern has not been investigated thoroughly. Herein, a series of 3D integrated gradient Cu‐based current collectors are fa...
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Wiley
2023-08-01
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Series: | Advanced Science |
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Online Access: | https://doi.org/10.1002/advs.202301288 |
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author | Yuhang Liu Yifan Li Zhuzhu Du Chen He Jingxuan Bi Siyu Li Wanqing Guan Hongfang Du Wei Ai |
author_facet | Yuhang Liu Yifan Li Zhuzhu Du Chen He Jingxuan Bi Siyu Li Wanqing Guan Hongfang Du Wei Ai |
author_sort | Yuhang Liu |
collection | DOAJ |
description | Abstract 3D Cu current collectors have been demonstrated to improve the cycling stability of Li metal anodes, however, the role of their interfacial structure for Li deposition pattern has not been investigated thoroughly. Herein, a series of 3D integrated gradient Cu‐based current collectors are fabricated by the electrochemical growth of CuO nanowire arrays on Cu foil (CuO@Cu), where their interfacial structures can be readily controlled by modulating the dispersities of the nanowire arrays. It is found that the interfacial structures constructed by sparse and dense dispersion of CuO nanowire arrays are both disadvantageous for the nucleation and deposition of Li metal, consequently fast dendrite growth. In contrast, a uniform and appropriate dispersity of CuO nanowire arrays enables stable bottom Li nucleation associated with smooth lateral deposition, affording the ideal bottom‐up Li growth pattern. The optimized CuO@Cu‐Li electrodes exhibit a highly reversible Li cycling including a coulombic efficiency of up to ≈99% after 150 cycles and a long‐term lifespan of over 1200 h. When coupling with LiFePO4 cathode, the coin and pouch full‐cells deliver outstanding cycling stability and rate capability. This work provides a new insight to design the gradient Cu current collectors toward high‐performance Li metal anodes. |
first_indexed | 2024-03-12T14:44:36Z |
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id | doaj.art-122a249e51004607ac067697a6c47aa5 |
institution | Directory Open Access Journal |
issn | 2198-3844 |
language | English |
last_indexed | 2024-03-12T14:44:36Z |
publishDate | 2023-08-01 |
publisher | Wiley |
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series | Advanced Science |
spelling | doaj.art-122a249e51004607ac067697a6c47aa52023-08-16T02:23:01ZengWileyAdvanced Science2198-38442023-08-011023n/an/a10.1002/advs.202301288Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial StructureYuhang Liu0Yifan Li1Zhuzhu Du2Chen He3Jingxuan Bi4Siyu Li5Wanqing Guan6Hongfang Du7Wei Ai8Frontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaFujian Cross Strait Institute of Flexible Electronics (Future Technologies) Fujian Normal University Fuzhou350117ChinaFrontiers Science Center for Flexible Electronics and Shaanxi Institute of Flexible Electronics Northwestern Polytechnical University 127 West Youyi RoadXi'an710072ChinaAbstract 3D Cu current collectors have been demonstrated to improve the cycling stability of Li metal anodes, however, the role of their interfacial structure for Li deposition pattern has not been investigated thoroughly. Herein, a series of 3D integrated gradient Cu‐based current collectors are fabricated by the electrochemical growth of CuO nanowire arrays on Cu foil (CuO@Cu), where their interfacial structures can be readily controlled by modulating the dispersities of the nanowire arrays. It is found that the interfacial structures constructed by sparse and dense dispersion of CuO nanowire arrays are both disadvantageous for the nucleation and deposition of Li metal, consequently fast dendrite growth. In contrast, a uniform and appropriate dispersity of CuO nanowire arrays enables stable bottom Li nucleation associated with smooth lateral deposition, affording the ideal bottom‐up Li growth pattern. The optimized CuO@Cu‐Li electrodes exhibit a highly reversible Li cycling including a coulombic efficiency of up to ≈99% after 150 cycles and a long‐term lifespan of over 1200 h. When coupling with LiFePO4 cathode, the coin and pouch full‐cells deliver outstanding cycling stability and rate capability. This work provides a new insight to design the gradient Cu current collectors toward high‐performance Li metal anodes.https://doi.org/10.1002/advs.202301288bottom‐up depositionCu current collectorsgradient designinterfacial structureLi metal batteries |
spellingShingle | Yuhang Liu Yifan Li Zhuzhu Du Chen He Jingxuan Bi Siyu Li Wanqing Guan Hongfang Du Wei Ai Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure Advanced Science bottom‐up deposition Cu current collectors gradient design interfacial structure Li metal batteries |
title | Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure |
title_full | Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure |
title_fullStr | Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure |
title_full_unstemmed | Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure |
title_short | Integrated Gradient Cu Current Collector Enables Bottom‐Up Li Growth for Li Metal Anodes: Role of Interfacial Structure |
title_sort | integrated gradient cu current collector enables bottom up li growth for li metal anodes role of interfacial structure |
topic | bottom‐up deposition Cu current collectors gradient design interfacial structure Li metal batteries |
url | https://doi.org/10.1002/advs.202301288 |
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