Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber
We investigated the thermal performance of a novel wettability patterned evaporator for an ultrathin vapor chamber. Because the evaporator integrates a wettability patterned substrate underneath the nanostructured mesh wick which can pin the three-phase contact lines on the hydrophilic/hydrophobic b...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2021-06-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X21000691 |
| _version_ | 1818723636602732544 |
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| author | Yinchuang Yang Jian Li Hongzhao Wang Dong Liao Huihe Qiu |
| author_facet | Yinchuang Yang Jian Li Hongzhao Wang Dong Liao Huihe Qiu |
| author_sort | Yinchuang Yang |
| collection | DOAJ |
| description | We investigated the thermal performance of a novel wettability patterned evaporator for an ultrathin vapor chamber. Because the evaporator integrates a wettability patterned substrate underneath the nanostructured mesh wick which can pin the three-phase contact lines on the hydrophilic/hydrophobic boundaries, it enlarges the area of thin-film evaporation. Microstructured wettability pattern is fabricated on the evaporator surface and the wick is pressed onto the evaporator by a micropillar array to make an intimate contact with each other. The micropillar array electroplated on the inner side of the condenser also supports a vapor core as a vapor flow path. The thermal resistance of the ultrathin vapor chamber is experimentally evaluated, and the measurement results show that the wettability pattern underneath the nanostructured mesh wick can greatly reduce the horizontal thermal resistance, giving a better temperature uniformity across the condenser side, though the vertical thermal resistance may be slightly larger than that without a wettability pattern. The highest in-plane effective thermal conductivity of a 200 μm-thick vapor chamber can reach 11914.9 W/(m·K) at 23.91 W/cm2 heat flux, which shows a 210.7% further improvement in comparison with that of the ultrathin vapor chamber with the nanostructured mesh wick only. |
| first_indexed | 2024-12-17T21:13:40Z |
| format | Article |
| id | doaj.art-12b18d77a3964562a5deb8e6eaf7a5b7 |
| institution | Directory Open Access Journal |
| issn | 2214-157X |
| language | English |
| last_indexed | 2024-12-17T21:13:40Z |
| publishDate | 2021-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Case Studies in Thermal Engineering |
| spelling | doaj.art-12b18d77a3964562a5deb8e6eaf7a5b72022-12-21T21:32:23ZengElsevierCase Studies in Thermal Engineering2214-157X2021-06-0125100906Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamberYinchuang Yang0Jian Li1Hongzhao Wang2Dong Liao3Huihe Qiu4Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaDepartment of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaDepartment of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaDepartment of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaCorresponding author.; Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, ChinaWe investigated the thermal performance of a novel wettability patterned evaporator for an ultrathin vapor chamber. Because the evaporator integrates a wettability patterned substrate underneath the nanostructured mesh wick which can pin the three-phase contact lines on the hydrophilic/hydrophobic boundaries, it enlarges the area of thin-film evaporation. Microstructured wettability pattern is fabricated on the evaporator surface and the wick is pressed onto the evaporator by a micropillar array to make an intimate contact with each other. The micropillar array electroplated on the inner side of the condenser also supports a vapor core as a vapor flow path. The thermal resistance of the ultrathin vapor chamber is experimentally evaluated, and the measurement results show that the wettability pattern underneath the nanostructured mesh wick can greatly reduce the horizontal thermal resistance, giving a better temperature uniformity across the condenser side, though the vertical thermal resistance may be slightly larger than that without a wettability pattern. The highest in-plane effective thermal conductivity of a 200 μm-thick vapor chamber can reach 11914.9 W/(m·K) at 23.91 W/cm2 heat flux, which shows a 210.7% further improvement in comparison with that of the ultrathin vapor chamber with the nanostructured mesh wick only.http://www.sciencedirect.com/science/article/pii/S2214157X21000691Microstructured wettability patternNanostructured wickUltrathin vapor chamberThermal resistanceEffective thermal conductivity |
| spellingShingle | Yinchuang Yang Jian Li Hongzhao Wang Dong Liao Huihe Qiu Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber Case Studies in Thermal Engineering Microstructured wettability pattern Nanostructured wick Ultrathin vapor chamber Thermal resistance Effective thermal conductivity |
| title | Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber |
| title_full | Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber |
| title_fullStr | Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber |
| title_full_unstemmed | Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber |
| title_short | Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber |
| title_sort | microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber |
| topic | Microstructured wettability pattern Nanostructured wick Ultrathin vapor chamber Thermal resistance Effective thermal conductivity |
| url | http://www.sciencedirect.com/science/article/pii/S2214157X21000691 |
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