| Summary: | Herein, the performance of silicone-modified 3D printing photosensitive resin was examined. Bisphenol-A epoxy acrylate (EA) was used as the substrate and isophorone diisocyanate, hydroxy-silicone oil, and hydroxyethyl acrylate were used as the raw materials. A silicone intermediate was synthesized to modify the substrate to prepare the 3D printing photosensitive material. The as-synthesized materials were characterized using Fourier transform infrared spectroscopy and scanning electron microscopy. The tensile fracture morphology was also analyzed. The effects of the addition of silicone intermediates on the mechanical properties, thermal stability, and shrinkage of the prepared 3D printing photosensitive resins were investigated. The results showed that an organosilicone group was successfully introduced into the side chain of EA. When the ratio of n(silicone):n(EA) is 0.3:1, the material has a high impact strength of 19.4 kJ·m−2, which is 32.8% higher than that of the pure resin; in addition, the elongation at break is 8.65% (compared to 6.56% of the pure resin). The maximum thermal weight loss temperature is 430.33°C, which is 6°C higher than that of the pure resin.
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