Numerical simulation of heat sinks with different configurations for high power LED thermal management
This study performed a steady-state numerical analysis to understand the temperature in different heat sink configurations for LED applications. Seven heat sink configurations named R, H-6, H-8, H-10, C, C3, and C3E3 were considered. Parameters like input power, number of fins, heat sink configurati...
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| Format: | Article |
| Language: | English |
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EDP Sciences
2022-01-01
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| Series: | International Journal for Simulation and Multidisciplinary Design Optimization |
| Subjects: | |
| Online Access: | https://www.ijsmdo.org/articles/smdo/full_html/2022/01/smdo220024/smdo220024.html |
| _version_ | 1811216074705731584 |
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| author | Ramesh Thangamani Praveen Ayyappan Susila Pillai Praveen Bhaskaran Salunkhe Sachin |
| author_facet | Ramesh Thangamani Praveen Ayyappan Susila Pillai Praveen Bhaskaran Salunkhe Sachin |
| author_sort | Ramesh Thangamani |
| collection | DOAJ |
| description | This study performed a steady-state numerical analysis to understand the temperature in different heat sink configurations for LED applications. Seven heat sink configurations named R, H-6, H-8, H-10, C, C3, and C3E3 were considered. Parameters like input power, number of fins, heat sink configuration were varied, and their influence on LED temperature distribution, heat sink thermal resistance and thermal interface material temperature were studied. The results showed that the temperature distribution of the H-6 heat sink decreased by 46.30% compared with the Cheat sink for an input power of 16 W. The result of the H-6 heat sink shows that the heat sink thermal resistance was decreased by 73.91% compared with the Cheat sink at 16 W. The lowest interface material temperature of 54.11 °C was achieved by the H-6 heat sink when the input power was used 16 W. The H-6 heat sink exhibited better performance due to more surface area with several fins than other heat sinks. |
| first_indexed | 2024-04-12T06:33:17Z |
| format | Article |
| id | doaj.art-13f91b16a4ee4e0a99ac36560a0d423d |
| institution | Directory Open Access Journal |
| issn | 1779-6288 |
| language | English |
| last_indexed | 2024-04-12T06:33:17Z |
| publishDate | 2022-01-01 |
| publisher | EDP Sciences |
| record_format | Article |
| series | International Journal for Simulation and Multidisciplinary Design Optimization |
| spelling | doaj.art-13f91b16a4ee4e0a99ac36560a0d423d2022-12-22T03:43:57ZengEDP SciencesInternational Journal for Simulation and Multidisciplinary Design Optimization1779-62882022-01-01131810.1051/smdo/2022009smdo220024Numerical simulation of heat sinks with different configurations for high power LED thermal managementRamesh Thangamani0Praveen Ayyappan Susila1Pillai Praveen Bhaskaran2Salunkhe Sachin3https://orcid.org/0000-0001-6542-2050Department of Mechanical Engineering, Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and TechnologyDepartment of Mechanical Engineering, Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and TechnologyClean Energy Research Group, Department of Mechanical and Aeronautical Engineering, University of PretoriaDepartment of Mechanical Engineering, Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and TechnologyThis study performed a steady-state numerical analysis to understand the temperature in different heat sink configurations for LED applications. Seven heat sink configurations named R, H-6, H-8, H-10, C, C3, and C3E3 were considered. Parameters like input power, number of fins, heat sink configuration were varied, and their influence on LED temperature distribution, heat sink thermal resistance and thermal interface material temperature were studied. The results showed that the temperature distribution of the H-6 heat sink decreased by 46.30% compared with the Cheat sink for an input power of 16 W. The result of the H-6 heat sink shows that the heat sink thermal resistance was decreased by 73.91% compared with the Cheat sink at 16 W. The lowest interface material temperature of 54.11 °C was achieved by the H-6 heat sink when the input power was used 16 W. The H-6 heat sink exhibited better performance due to more surface area with several fins than other heat sinks.https://www.ijsmdo.org/articles/smdo/full_html/2022/01/smdo220024/smdo220024.htmlledthermal resistancefeaheat sinkstemperature of interface material |
| spellingShingle | Ramesh Thangamani Praveen Ayyappan Susila Pillai Praveen Bhaskaran Salunkhe Sachin Numerical simulation of heat sinks with different configurations for high power LED thermal management International Journal for Simulation and Multidisciplinary Design Optimization led thermal resistance fea heat sinks temperature of interface material |
| title | Numerical simulation of heat sinks with different configurations for high power LED thermal management |
| title_full | Numerical simulation of heat sinks with different configurations for high power LED thermal management |
| title_fullStr | Numerical simulation of heat sinks with different configurations for high power LED thermal management |
| title_full_unstemmed | Numerical simulation of heat sinks with different configurations for high power LED thermal management |
| title_short | Numerical simulation of heat sinks with different configurations for high power LED thermal management |
| title_sort | numerical simulation of heat sinks with different configurations for high power led thermal management |
| topic | led thermal resistance fea heat sinks temperature of interface material |
| url | https://www.ijsmdo.org/articles/smdo/full_html/2022/01/smdo220024/smdo220024.html |
| work_keys_str_mv | AT rameshthangamani numericalsimulationofheatsinkswithdifferentconfigurationsforhighpowerledthermalmanagement AT praveenayyappansusila numericalsimulationofheatsinkswithdifferentconfigurationsforhighpowerledthermalmanagement AT pillaipraveenbhaskaran numericalsimulationofheatsinkswithdifferentconfigurationsforhighpowerledthermalmanagement AT salunkhesachin numericalsimulationofheatsinkswithdifferentconfigurationsforhighpowerledthermalmanagement |