Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering

Cu − SiC composites were studied by scanning electron microscopy after processes of molding and a heat treatment. After pressing, plastic deformation of copper particles and traces of destruction of silicon carbide (cracks and debris) are observed. After the solid-phase sintering, formation of a por...

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Main Authors: N.A. Pan’kin, Vl.P. Mishkin
Format: Article
Language:Russian
Published: Tver State University 2018-12-01
Series:Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов
Subjects:
Online Access:https://physchemaspects.ru/archives/2018/fh2018-doi-10-26456-pcascnn-2018-10-517.pdf
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author N.A. Pan’kin
Vl.P. Mishkin
author_facet N.A. Pan’kin
Vl.P. Mishkin
author_sort N.A. Pan’kin
collection DOAJ
description Cu − SiC composites were studied by scanning electron microscopy after processes of molding and a heat treatment. After pressing, plastic deformation of copper particles and traces of destruction of silicon carbide (cracks and debris) are observed. After the solid-phase sintering, formation of a porous structure in the matrix material is noted without significant changes in the filler particles. Data on the distribution of chemical elements near the SiC − Cu interface indicate an insignificant effect of diffusion processes.
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spelling doaj.art-1431e08619ba4299a8280d7bf5462b202022-12-21T23:20:40ZrusTver State UniversityФизико-химические аспекты изучения кластеров, наноструктур и наноматериалов2226-44422658-43602018-12-011051752310.26456/pcascnn/2018.10.517Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sinteringN.A. Pan’kin0Vl.P. Mishkin1National Research N.P. Ogarev Mordovia State UniversityNational Research N.P. Ogarev Mordovia State UniversityCu − SiC composites were studied by scanning electron microscopy after processes of molding and a heat treatment. After pressing, plastic deformation of copper particles and traces of destruction of silicon carbide (cracks and debris) are observed. After the solid-phase sintering, formation of a porous structure in the matrix material is noted without significant changes in the filler particles. Data on the distribution of chemical elements near the SiC − Cu interface indicate an insignificant effect of diffusion processes.https://physchemaspects.ru/archives/2018/fh2018-doi-10-26456-pcascnn-2018-10-517.pdfcompositeelectron microscopycoppersilicon carbidemicrostructurepores
spellingShingle N.A. Pan’kin
Vl.P. Mishkin
Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов
composite
electron microscopy
copper
silicon carbide
microstructure
pores
title Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering
title_full Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering
title_fullStr Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering
title_full_unstemmed Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering
title_short Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering
title_sort electron microscopy of cu sic composites a cold molding and solid phase sintering
topic composite
electron microscopy
copper
silicon carbide
microstructure
pores
url https://physchemaspects.ru/archives/2018/fh2018-doi-10-26456-pcascnn-2018-10-517.pdf
work_keys_str_mv AT napankin electronmicroscopyofcusiccompositesacoldmoldingandsolidphasesintering
AT vlpmishkin electronmicroscopyofcusiccompositesacoldmoldingandsolidphasesintering