Recent advances on thermal analysis of stretchable electronics
Stretchable electronics, which offers the performance of conventional wafer-based devices and mechanical properties of a rubber band, enables many novel applications that are not possible through conventional electronics due to its brittle nature. One effective strategy to realize stretchable electr...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2016-01-01
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| Series: | Theoretical and Applied Mechanics Letters |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2095034915001063 |
| _version_ | 1818693275557560320 |
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| author | Yuhang Li Yuyan Gao Jizhou Song |
| author_facet | Yuhang Li Yuyan Gao Jizhou Song |
| author_sort | Yuhang Li |
| collection | DOAJ |
| description | Stretchable electronics, which offers the performance of conventional wafer-based devices and mechanical properties of a rubber band, enables many novel applications that are not possible through conventional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate. Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1–2 °C temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations. |
| first_indexed | 2024-12-17T13:11:06Z |
| format | Article |
| id | doaj.art-1542b113c6034fef9340217dc89f5f36 |
| institution | Directory Open Access Journal |
| issn | 2095-0349 |
| language | English |
| last_indexed | 2024-12-17T13:11:06Z |
| publishDate | 2016-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Theoretical and Applied Mechanics Letters |
| spelling | doaj.art-1542b113c6034fef9340217dc89f5f362022-12-21T21:47:07ZengElsevierTheoretical and Applied Mechanics Letters2095-03492016-01-0161323710.1016/j.taml.2015.12.001Recent advances on thermal analysis of stretchable electronicsYuhang Li0Yuyan Gao1Jizhou Song2Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, ChinaDepartment of Engineering Mechanics, Zhejiang University, Hangzhou 310027, ChinaDepartment of Engineering Mechanics, Zhejiang University, Hangzhou 310027, ChinaStretchable electronics, which offers the performance of conventional wafer-based devices and mechanical properties of a rubber band, enables many novel applications that are not possible through conventional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate. Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1–2 °C temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations.http://www.sciencedirect.com/science/article/pii/S2095034915001063Stretchable electronicsThermal analysisScaling law |
| spellingShingle | Yuhang Li Yuyan Gao Jizhou Song Recent advances on thermal analysis of stretchable electronics Theoretical and Applied Mechanics Letters Stretchable electronics Thermal analysis Scaling law |
| title | Recent advances on thermal analysis of stretchable electronics |
| title_full | Recent advances on thermal analysis of stretchable electronics |
| title_fullStr | Recent advances on thermal analysis of stretchable electronics |
| title_full_unstemmed | Recent advances on thermal analysis of stretchable electronics |
| title_short | Recent advances on thermal analysis of stretchable electronics |
| title_sort | recent advances on thermal analysis of stretchable electronics |
| topic | Stretchable electronics Thermal analysis Scaling law |
| url | http://www.sciencedirect.com/science/article/pii/S2095034915001063 |
| work_keys_str_mv | AT yuhangli recentadvancesonthermalanalysisofstretchableelectronics AT yuyangao recentadvancesonthermalanalysisofstretchableelectronics AT jizhousong recentadvancesonthermalanalysisofstretchableelectronics |