Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint

Friction stir welding of 1016 pure aluminum and T2 pure copper with 2 mm thickness was carried out in the form of lap welding of copper on the upper side and aluminum on the lower side. The growth of interface microstructure between 1016 pure aluminum and T2 pure copper welded by friction stir weldi...

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Main Authors: Yuhua Jin, Bo Wu, Xuetian Lu, Yichu Xing, Zizheng Zhou
Format: Article
Language:English
Published: MDPI AG 2020-10-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/13/20/4591
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author Yuhua Jin
Bo Wu
Xuetian Lu
Yichu Xing
Zizheng Zhou
author_facet Yuhua Jin
Bo Wu
Xuetian Lu
Yichu Xing
Zizheng Zhou
author_sort Yuhua Jin
collection DOAJ
description Friction stir welding of 1016 pure aluminum and T2 pure copper with 2 mm thickness was carried out in the form of lap welding of copper on the upper side and aluminum on the lower side. The growth of interface microstructure between 1016 pure aluminum and T2 pure copper welded by friction stir welding was studied. The growth mechanism of the intermetallic compound (IMC) layer in the Cu-Al lap joint was revealed by annealing at 300, 350, 400 °C. The intermetallic compound (IMC) layer in the lap joint grows again during annealing, and only the original structure of the intermetallic compound (IMC) layer grows at lower annealing temperature and holding time. At higher annealing temperature and holding time, the original structure of intermetallic compound (IMC) layer no longer grows, and a new layered structure appears in the middle of the original structure. There is a gradient change of microhardness in the nugget zone. With different holding times, different softening phenomena appear in the metals on both sides of copper and aluminum. When the hardness decreases to a certain extent, it will not continue to decrease with the increase of holding time. When the annealing temperature is 350 °C and 400 °C, the strength of the tensile sample increases first and then decreases with the increase of holding time. At the interface of Cu-Al, the fracture runs through the whole intermetallic compound (IMC) layer.
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spelling doaj.art-15a38724802d414e9098eaa53b327eed2023-11-20T17:15:33ZengMDPI AGMaterials1996-19442020-10-011320459110.3390/ma13204591Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded JointYuhua Jin0Bo Wu1Xuetian Lu2Yichu Xing3Zizheng Zhou4State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, School of Materials Scienceand Engineering, Lanzhou University of Technology, Lanzhou 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, School of Materials Scienceand Engineering, Lanzhou University of Technology, Lanzhou 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, School of Materials Scienceand Engineering, Lanzhou University of Technology, Lanzhou 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, School of Materials Scienceand Engineering, Lanzhou University of Technology, Lanzhou 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, School of Materials Scienceand Engineering, Lanzhou University of Technology, Lanzhou 730050, ChinaFriction stir welding of 1016 pure aluminum and T2 pure copper with 2 mm thickness was carried out in the form of lap welding of copper on the upper side and aluminum on the lower side. The growth of interface microstructure between 1016 pure aluminum and T2 pure copper welded by friction stir welding was studied. The growth mechanism of the intermetallic compound (IMC) layer in the Cu-Al lap joint was revealed by annealing at 300, 350, 400 °C. The intermetallic compound (IMC) layer in the lap joint grows again during annealing, and only the original structure of the intermetallic compound (IMC) layer grows at lower annealing temperature and holding time. At higher annealing temperature and holding time, the original structure of intermetallic compound (IMC) layer no longer grows, and a new layered structure appears in the middle of the original structure. There is a gradient change of microhardness in the nugget zone. With different holding times, different softening phenomena appear in the metals on both sides of copper and aluminum. When the hardness decreases to a certain extent, it will not continue to decrease with the increase of holding time. When the annealing temperature is 350 °C and 400 °C, the strength of the tensile sample increases first and then decreases with the increase of holding time. At the interface of Cu-Al, the fracture runs through the whole intermetallic compound (IMC) layer.https://www.mdpi.com/1996-1944/13/20/4591aluminum alloycopperfriction stir weldingannealingintermetallic compounds
spellingShingle Yuhua Jin
Bo Wu
Xuetian Lu
Yichu Xing
Zizheng Zhou
Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint
Materials
aluminum alloy
copper
friction stir welding
annealing
intermetallic compounds
title Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint
title_full Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint
title_fullStr Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint
title_full_unstemmed Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint
title_short Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint
title_sort effect of post weld annealing on microstructure and growth behavior of copper aluminum friction stir welded joint
topic aluminum alloy
copper
friction stir welding
annealing
intermetallic compounds
url https://www.mdpi.com/1996-1944/13/20/4591
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