Transient liquid phase bonding of Ni3Al based superalloy using Mn–Ni–Cr filler
A new 70Mn–25Ni–5Cr (wt. %) filler with no traditional melting-point depressants (MPDs) of Si/B was used for transient liquid phase (TLP) bonding a directionally solidified (DS) superalloy based on Ni3Al intermetallic compound (IMC) at 1150 °C, a pressure of 2 MPa for 10–120 min. Experimental result...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421001435 |