Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packagin...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-12-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/16/24/7652 |
| _version_ | 1797380175445360640 |
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| author | Ye Jin Jang Ashutosh Sharma Jae Pil Jung |
| author_facet | Ye Jin Jang Ashutosh Sharma Jae Pil Jung |
| author_sort | Ye Jin Jang |
| collection | DOAJ |
| description | Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency. |
| first_indexed | 2024-03-08T20:33:33Z |
| format | Article |
| id | doaj.art-16fedb328f914d79a225437eed74cdca |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-08T20:33:33Z |
| publishDate | 2023-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-16fedb328f914d79a225437eed74cdca2023-12-22T14:22:57ZengMDPI AGMaterials1996-19442023-12-011624765210.3390/ma16247652Advanced 3D Through-Si-Via and Solder Bumping Technology: A ReviewYe Jin Jang0Ashutosh Sharma1Jae Pil Jung2Department of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of KoreaDepartment of Materials Science and Engineering, Ajou University, 206-Worldcup-ro, Yeongtong-gu, Gyeonggi-do, Suwon 16499, Republic of KoreaDepartment of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of KoreaThree-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.https://www.mdpi.com/1996-1944/16/24/7652three-dimensional packagingthrough-Si-viaCu pillar bondinghybrid composite bondinghigh entropy alloys |
| spellingShingle | Ye Jin Jang Ashutosh Sharma Jae Pil Jung Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review Materials three-dimensional packaging through-Si-via Cu pillar bonding hybrid composite bonding high entropy alloys |
| title | Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review |
| title_full | Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review |
| title_fullStr | Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review |
| title_full_unstemmed | Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review |
| title_short | Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review |
| title_sort | advanced 3d through si via and solder bumping technology a review |
| topic | three-dimensional packaging through-Si-via Cu pillar bonding hybrid composite bonding high entropy alloys |
| url | https://www.mdpi.com/1996-1944/16/24/7652 |
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